Taiwan Semiconductor Manufacturing Comp. Ltd.

Nien-Tsung Tsai

Kuei-Sung Chang

Ting-Hau Wu

Yi Heng Tsai

Chun-Wen Cheng

Chia-Hua Chu

Jung-Huei Peng

Yao-Te Huang

Yu-Chia Liu

Li-Min Hung

Some embodiments of the present disclosure provide a microelectromechanical systems (MEMS). The MEMS includes a semiconductive block. The semiconductive block includes a protruding structure. The protruding structure includes a bottom surface. The semiconductive block includes a sensing structure. A semiconductive substrate includes a conductive region. The conductive region includes a first surface under the sensing structure. The first surface is substantially coplanar with the bottom surface. A dielectric region includes a second surface not disposed over the first surface.

Micro-electro-mechanical system and manufacturing method thereof

Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a method includes forming a contact pad over a semiconductor device. A passivation material is formed over the contact pad. The passivation material has a thickness and is a type of material such that an electrical connection may be made to the contact pad through the passivation material.

Semiconductor devices and methods of manufacture thereof

A system and method for bonding semiconductor devices is provided. An embodiment comprises halting the flow of a eutectic bonding material by providing additional material of one of the reactants in a grid pattern, such that, as the eutectic material flows into the additional material, the additional material will change the composition of the flowing eutectic material and solidify the material, thereby stopping the flow. Other embodiments provide for additional layouts to put the additional material into the path of the flowing eutectic material.

Semiconductor bonding structure and process

Growing community of inventors

Hsin-Chu, Taiwan

Nien-Tsung Tsai