Karlsruher Institut Fur Technologie

Nicole Lindenmann

Christian Koos

Wolfgang Freude

Matthias Blaicher

Juerg Leuthold

Tobias Hoose

Philipp Dietrich

Maria Laura Gödecke

Timo Mappes

Sebastian Köber

Disclosed is a method for lithographically producing a target structure on a non-planar initial structure by exposing a photoresist by means of a lithography beam. In the inventive method, the topography of a surface of the non-planar initial structure is detected. A test parameter for the lithography beam is used and an interaction of the lithography beam with the initial structure and the resultant change in the lithography beam and/or the target structure to be produced are determined. A correction parameter for the lithography beam is determined such that the change in the lithography beam and/or the target structure to be produced that is caused by the interaction of the lithography beam with the initial structure is reduced. The desired target structure on the initial structure is produced by exposing the photoresist by means of the lithography beam using the correction parameter.

Method and device for lithographically producing a target structure on a non-planar initial structure

The present invention provides a process for producing an optical waveguide () more particularly for integrated photonic systems. This process comprises provision of polymerizable material; local polymerization of the polymerizable material to produce a multiplicity of polymerized structural elements (); removal of the unpolymerized regions of the polymerizable material; and heating of the polymerized material more particularly above the glass transition temperature thereof in order to fuse the multiplicity of polymerized structural elements () together to form the optical waveguide ().

Production of 3D free-form waveguide structures

A method for making optical connections with optical waveguides includes mounting the optical waveguides or a device comprising the optical waveguides, on a component carrier. A partial region of the optical waveguides is embedded in a volume of resist material. Positions of the optical waveguides to be connected are detected with reference to a coordinate system using a measuring system. Favorable, three-dimensional geometries are determined for optical waveguide structures for connecting the optical waveguides to each other at predetermined connecting locations and the optical waveguide structure geometries are converted to a machine-readable dataset. The optical waveguide geometries in the volume of the resist material are three-dimensionally structured using a direct-writing lithography device operating on the basis of the machine-readable dataset. The structured resist material is treated using physical or chemical methods to form at least one optical waveguide structure having ends connected to predetermined connecting locations of the optical waveguides.

Method for producing photonic wire bonds

An optical arrangement includes a plurality of planar substrates with at least one planar integrated optical waveguide on each planar substrate. At least one optical waveguide structure has at least one end connected via an optical connecting structure to one of the planar integrated optical waveguides. The optical waveguide structure is positioned at least partly outside the integration plane for the planar integrated optical waveguide and a refractive index contrast between a core region and a cladding region of the optical waveguide structure is at least 0.01.

Growing community of inventors

Karlsruhe, Germany

Nicole Lindenmann