University of Virginia Patent Foundation

Nicolas Scott Barker

Robert M Weikle, Ii

Arthur Weston Lichtenberger

Theodore James Reck

Haiyong Xu

Lihan Chen

Linli Xie

Michael E Cyberey

Souheil Nadri

Ii Robert M Weikle

A probe chip device and a method for fabricating a probe chip device with an integrated diode sensor are disclosed. In one example, a probe chip device includes a beam head element that includes at least one probe tip that is configured to electrically probe a device under test. The probe chip device further includes a diode sensor that is heterogeneously integrated on the beam head element and is proximally positioned to the at least one probe tip.

System and method for integrating diode sensors on micromachined wafer probes

A micromachining process to fabricate a single chip that simple drops into a supporting structure. The micromachining process provides the ability to create a probe that will interface with integrated circuits, for example, operating at frequencies in the range of about 100 GHz to about 3,000 GHz (3 THz). This approach creates a silicon structure (or other applicable choice of material) that provides mechanical force for probing while supporting the transfer of the high frequency energy between a measurement system and the integrated circuit, individual device or material.

Micromachined on-wafer probes and related method

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Charlottesville, VA, United States of America

Nicolas Scott Barker