Sony Corporation

Nicolas Nagel

Kenji Katori

Koji Watanabe

Masahiro Tanaka

An electronic material is expressed by the composition formula M.sub.Ia M.sub.IIb O.sub.c (where a, b and c are compositions in atomic %, M.sub.I is at least one sort of noble metal selected from the group consisting of Pt, Ir, Ru, Rh and Pd, and M.sub.II is at least one sort of transition metal selected from the group consisting of Hf, Ta, Zr, Nb, V, Mo and W) having a composition within the range of 90.gtoreq.a.gtoreq.40, 15.gtoreq.b.gtoreq.2, 4.ltoreq.c and a+b+c=100. A dielectric capacitor comprises: a diffusion preventing layer made of the material expressed by the composition formula M.sub.ia M.sub.IIb O.sub.c ; a lower electrode on the diffusion preventing layer; a dielectric film on the lower electrode; and an upper electrode on the dielectric film. Another dielectric capacitor comprises: a diffusion preventing layer made of a material expressed by the composition formula M.sub.Ia M.sub.IIb O.sub.c (where a, b and c are compositions in atomic %, M.sub.II is at least one sort of noble metal selected from the group consisting of Pt, Ir, Ru, Rh and Pd, and M.sub.II is at least one sort of rare earth element) having a composition within the range of 90.gtoreq.a.gtoreq.40, 15.gtoreq.b.gtoreq.2, 4.ltoreq.c and a+b+c=100; a lower electrode on the diffusion preventing layer; a dielectric film on the lower electrode; and an upper electrode on the dielectric film.

Electronic material, its manufacturing method, dielectric capacitor,

A capacitor structure of a semiconductor memory cell such as a FERAM has an upper electrode less susceptible a damage even by heat-treatment in a hydrogen gas atmosphere. The capacitor structure includes a lower electrode, a capacitor thin film formed of a ferroelectric thin film formed on the lower electrode, and an upper electrode formed on the capacitor thin film. The upper electrode is made of Ru.sub.1-x O.sub.x (0.1&lt;x&lt;0.64).

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Kanagawa, Japan

Nicolas Nagel