Intel Corporation

Nicolas A Kurczewski

Russell S Aoki

Anthony P Valpiani

Michael Hui

Peter Wesley Bristol

Tod A Byquist

James W Edwards

Michael S Brazel

Robert R Atkinson

Patrick S Johnson

Meenakshi Gupta

Brian R Peil

Stephen J Allen

Barry T Dale

Nicholas R Weber

Kristin L Weihl

Stella Latscha

Alexander D Williams

Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion that includes a cradle dock to allow the display portion to be removably connected to the keyboard portion in a first configuration, where a viewing angle of the display portion can be adjusted.

Stacking detachable tablet

A system and method for adaptive thermal and performance management in electronic devices are disclosed. A particular embodiment includes: providing a processor with a plurality of selectable performance levels and a sensor in an electronic device; receiving sensor information from the sensor, the sensor information including information for determining if the electronic device is positioned proximately to an active airflow; determining a device context from the sensor information; and dynamically modifying the performance level of the processor by implementing one of a plurality of selectable performance levels of the processor based on the device context.

System and method for adaptive thermal and performance management in electronic devices

In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect the first section of the chassis to the second section of the chassis for an electronic device, comprising a first hinge assembly to be coupled to the first section of the chassis for the electronic device, a second hinge assembly to be coupled to the second section of the chassis for the electronic device, a first rigid connecting member to be coupled to the first hinge assembly and the second hinge assembly, a first resistance element to provide a first rotational resistance between the first hinge assembly and a first end of the first rigid connecting member and a first resistance element to provide a second rotational resistance between the second hinge assembly and a second end of the first rigid connecting member. Other embodiments may be described.

Hinge assembly

In one embodiment a locking mechanism for a hinge, comprises a housing defining a chamber which is to contain a magnetorheological (MR) fluid, a bias mechanism which disposed at a first end of the chamber, a piston disposed at a second end of the chamber, the piston to be coupled to a hinge rotatable about a first axis, wherein rotation of the hinge about the first axis translates the piston laterally in the housing on a first side of the chamber, and a magnet positioned proximate the housing to change the MR fluid from a first state in which the MR fluid exhibits a low viscosity to a second state in which the MR exhibits a high viscosity. Other embodiments may be described.

Locking mechanism for hinge assembly

Growing community of inventors

Dupont, WA, United States of America

Nicolas A Kurczewski