Imec Vzw

Imec

Pacific Biosciences of California, Inc.

Nicolaas Tack

Andy Lambrechts

Luc Haspeslagh

Bart Vereecke

Annette Claire Grot

Ravi Saxena

Jonathan Borremans

Maarten Rosmeulen

Simone Severi

Murali Jayapala

Bert Geelen

Deniz Sabuncuoglu Tezcan

Philippe Soussan

Piet De Moor

Bert Du Bois

Nick Spooren

Julien Pichette

Paul Goetschalckx

Pilar Gonzalez

A method for calibrating an image sensor begins by illuminating a portion of the image sensor with an input light spectrum, where the input light spectrum includes light of known wavelength and intensity. The method continues by sampling an output for each optical sensor of the image sensor, where each optical sensor is associated with one or more optical filters and where each optical filter being associated with a group of optical filters of a plurality of groups of optical filters. Each optical filter of a group of optical filters is configured to pass light in a different wavelength range and at least some optical filters in different groups of the plurality of groups of optical filters are configured to pass light in substantially a same wavelength range. The method then continues by comparing a sampled output for each optical sensor of the plurality of optical sensors with an expected output and generating a calibration factor for each of at least a subset of the plurality of optical sensors and storing the generated calibration factors in memory.

Hyperspectral image sensor with calibration

A spectral sensor comprises (i) a first type of interference filter comprising reflective multilayers of a first type and an intermediate layer configured to give a constructive interference for a wavelength in a first range, and (ii) a second type of interference filter comprising reflective multilayers of a second type and an intermediate layer configured to give a constructive interference for a wavelength in a second range. The sensor further comprises first and second filter stacks configured to selectively transmit light in the first and second wavelength ranges to first and second photo-sensitive areas, respectively. The first filter stack includes the first type of interference filter and a second type of dielectric mirror that is reflective in the second wavelength range. The second filter stack includes the second type of interference filter and a first type of dielectric mirror that is reflective in the first wavelength range.

Spectral sensor for multispectral imaging

An imaging sensor comprises: an array of light-detecting elements, wherein each light-detecting element in the array of light-detecting elements is arranged in the imaging sensor so as to detect a respective wavelength interval, wherein the respective wavelength interval differs for different light-detecting elements; a pattern arranged on the array of light-detecting elements, wherein the pattern defines a plurality of transparent areas, each transparent area being associated with a corresponding light-detecting element in the array of light-detecting elements, wherein a size of a transparent area among the plurality of transparent areas is dependent of the corresponding light-detecting element with which the transparent area is associated.

Imaging sensor

An example method and hyperspectral imaging (HSI) system for imaging a scene are provided. The method is for imaging the scene with the HSI system including a sensor with a plurality of sensor pixels and a plurality of spectral filters, each of the spectral filters being associated with one of the sensor pixels. The method comprises obtaining a higher-resolution spatial image by illuminating the scene with a first set of wavelengths, wherein each spectral filter passes the first set of wavelengths to the sensor pixel it is associated with. The method further comprises obtaining a lower-resolution hyperspectral image by illuminating the scene with a second set of wavelengths, wherein each spectral filter passes only a subset of the second set of wavelengths to the sensor pixel it is associated with.

Use of spectral leaks to obtain high spatial resolution information for hyperspectral imaging

An integrated circuit for an imaging system is disclosed. In one aspect, an integrated circuit has an array of optical sensors, an array of optical filters integrated with the sensors and configured to pass a band of wavelengths onto one or more of the sensors, and read out circuitry to read out pixel values from the sensors to represent an image. Different ones of the optical filters are configured to have a different thickness, to pass different bands of wavelengths by means of interference, and to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non-monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.

Integrated circuit for spectral imaging system

An image sensor for acquiring an image of an object comprises: an array of photo-sensitive areas (); and a mosaic filter () associated with the array dividing the array into sub-groups () of photo-sensitive areas () extending across at least two rows and two columns, wherein the mosaic filter () transmits unique light properties to the photo-sensitive areas () within the sub-group (); wherein the mosaic filter () comprises a sequence of unique filter portions associated with a set of photo-sensitive areas () along a row, wherein the set extends through more than one sub-group (); wherein sequences comprising the unique filter portions are associated with each row and wherein the sequences associated with adjacent rows comprise different orders of the unique filter portions, such that different light properties are transmitted to photo-sensitive areas () in the same column of adjacent rows.

Hyperspectral imager for snapshot and line-scan modes

An imaging sensor is disclosed, comprising: a set of at least two charge-coupled device, CCD, sub-arrays, wherein each sub-array comprises pixels arranged in columns and rows, and each pixel being arranged to accumulate an electric charge proportional to an intensity of light incident on the pixel; a time delay and integration, TDI, clocking circuitry for controlling and timing transfer of accumulated electric charges between rows of pixels in a column direction in order to integrate the accumulated electric charges in each column of pixels; wherein each CCD sub-array further comprises a readout row for converting the integrated electric charge of each column of pixels into voltage or current, wherein the readout row comprises transistors enabling readout of the signal by the readout block; and a readout block which is arranged to receive input from selected readout rows and convert the input into digital domain or convert the input to a combined representation of pixel values based on the set of CCD sub-arrays.

Imaging sensor and method for reading out image information

Arrays of integrated optical devices and their methods for production are provided. The devices include an integrated bandpass filter layer that comprises at least two multi-cavity filter elements with different central bandpass wavelengths. The device arrays are useful in the analysis of highly multiplexed optical reactions in large numbers at high densities, including biochemical reactions, such as nucleic acid sequencing reactions. The devices provide for the efficient and reliable coupling of optical excitation energy from an optical source to the optical reactions. Optical signals emitted from the reactions can thus be measured with high sensitivity and discrimination. The device arrays are well suited for miniaturization and high throughput.

Arrays of optical devices comprising integrated bandpass filters and methods of production

An integrated circuit for an imaging device including an array of photo-sensitive areas is disclosed. In one aspect the integrated circuit includes a first multi-layer structure and a second multi-layer structure arranged over a first and a second photo-sensitive area, respectively. The second multi-layer structures each have a bottom and a top reflective structure and a spacer layer arranged therebetween. The spacer layer has a thickness such that the multi-layer structure selectively transmits a narrow range of wavelengths of electro-magnetic radiation. The bottom and top reflective structures include a stack of alternating layers of a first and a second material. Thickness and/or material of the alternating layers of the first multi-layer structure differ from thickness and/or material of the alternating layers of the second multi-layer structure.

Growing community of inventors

Buggenhout, Belgium

Nicolaas Tack