Nxp B.v.

Ipdia

Nicolaas J A Van Veen

Teunis Jan Ikkink

Hans M B Boeve

Fabrice Verjus

Francois Lecornec

Jean-Marc Yan-Nou

David Chevrie

A device substrate has a device major surface, a semiconductor element on the device major surface, and electrically conductive device connectors extending across the device major surface. An interconnection substrate has an interconnection substrate having an interconnection major surface, the interconnection substrate defining at least one sealing recess recessed from the interconnection major surface, the sealing recess being surrounded by a sealing ring. The device substrate is mounted on the interconnection substrate with the interconnection major surface facing the device major surface, the sealing ring around the semiconductor element and with the device major surface sealed against the sealing ring so that the recess forms a sealed cavity containing the semiconductor element. Electrical interconnects extend across the interconnection major surface. Interconnection bumps are provided outside the sealing ring to electrically connect the device to the interconnect substrate.

Integrated package

A device () comprising a sensor module () with a package () is produced at reduced costs by providing the package () with two or more substrates () each with a functional layer (), at least one sensor () such as a magnetometer and/or an accelerometer being located in at least one functional layer (), and by providing the package () with a system comprising solder bumps (-) for aligning the functional layers (). The system either comprises a first number of solder bumps () for coupling the functional layers () electrically and mechanically to each other via first bonding elements () or comprises a third substrate () with a third functional layer () and a second number of solder bumps () for coupling the first and third functional layers () electrically and mechanically to each other via second bonding elements () and a third number of solder bumps () for coupling the second and third functional layers () electrically and mechanically to each other via third bonding elements (). Mechanically and/or electrically dummy solder bumps improve the alignment of the functional layers ().

Device comprising a sensor module

Growing community of inventors

Geldrop, Netherlands

Nicolaas J A Van Veen