Atmel Corporation

Nicola Telecco

Vijay P Adusumilli

Vijaya Pratap Adusumilli

Anil Gupta

Steven J Schumann

Edward S Hui

Victor V Nguyen

Abbas S Tehrani

Column redundancy is provided outside of a FLASH memory chip using a separate companion controller chip. The companion chip initially receives and stores fuse address information from the FLASH memory chip for defective memory cells in the FLASH memory. In a read mode of operation, the companion control chip detects receipt of a defective address from the FLASH memory and stores in a redundant shift register redundant data that is downloaded from the FLASH memory chip. The redundant data is used to provide correct FLASH memory data to an external user that interfaces with the companion control chip. In a program mode of operation, the companion control chip provides redundant bits that are stored in redundant columns in the FLASH memory chip. The companion control chip provides flexibility by readily providing a number of different redundancy schemes for bits, nibbles, or bytes without requiring additional logic circuits in the FLASH memory chip itself. Data is transferred between the FLASH memory chip and the companion control chip a byte at a time.

Redundancy scheme in memory

A programmable memory device circuit comprising a sense and programming circuit, a latch circuit, a verify circuit for coupling the latch circuit logic value to a shared indicator line, and a direct memory access circuit coupled to the verify circuit. The DMA circuit couples a bit line to the verify circuit, and the verify circuit couples the direct memory access circuit to a shared verify indicator and DMA line.

Data register with efficient erase, program verify, and direct bit-line memory access features

A nonvolatile memory apparatus includes a separate controller circuit and memory circuit. The controller circuit is fabricated on a first integrated circuit chip. The controller circuit includes a plurality of charge pump circuits, a system interface logic circuit, a memory control logic circuit, and one or more analog circuits. The memory circuit is fabricated on a second integrated circuit chip and includes a column decoder, a row decoder, a control register, and a data register. A memory-controller interface area includes a first plurality of die bond pads on the first integrated circuit chip and a second plurality of die bond pads on the second integrated circuit chip such that the first and second integrated circuit chips may be die-bonded together. A single controller circuit may interface with a plurality of memory circuits, thus further reducing overall costs as each memory circuit does not require a dedicated controller circuit.

Nonvolatile semiconductor memory apparatus

A voltage regulator for supplying two types of loads on a common chip, namely a high current load and a low current load. The voltage regulator employs a feedback loop to supply the low current load with a fine degree of regulation and a feed forward arrangement to supply the high current load with a coarse degree of regulation. The feedback loop employs a bandgap reference source feeding a comparator, with an output driver transistor drawing current from a common supply and having an output electrode connected to a voltage divider, allowing a sample of the output to be fed back to the comparator to maintain the desired output voltage. The output electrode also feeds a control transistor for the feed forward arrangement that also draws current from the common supply and supplies the high current load directly. An example of a single chip circuit employing the present invention is a charge pump where the high current load is a series of large capacitors used to multiply charge to produce a high voltage and the low current load is a plurality of clock circuits that apply timing pulses to switches for proper phasing of the capacitors and associated switches to achieve the desired high voltage.

Dual stage voltage regulation circuit

The present invention is related to semiconductor memories, and in particular, to a nonvolatile or flash memory and method that reduces the effect of or is tolerant of over-erased memory cells. When a memory cell is read, a read voltage is applied to at least one target memory cell, and a negative bias voltage that is lower than a threshold voltage of an over-erased memory cell is also applied to at least one other selected memory cell that is in the same row as the target memory cell. Applying a negative bias voltage to adjacent or proximate memory cells shuts off nearby cells to isolate current that may come from over-erased memory cells during a read, program, or erase operation.

Memory architecture with enhanced over-erase tolerant control gate scheme

A system and method for performing a simultaneous external read operation during internal programming of a memory device is described. The memory device is configured to store data randomly and includes a source location, a destination location, a data register, and a cache register. The data register is configured to simultaneously write data to the destination and to the cache register. The system further includes a processing device (e.g., a microprocessor or microcontroller) for verifying an accuracy of any data received through electrical communication with the memory device. The processing device is additionally configured to provide for error correction if the received data is inaccurate, add random data to the data, if required, and then transfer the error-corrected and/or random data modified data back to the destination location.

Simultaneous external read operation during internal programming in a flash memory device

A direct memory access interface incorporates setting bit line selection data into a particular storage element of a desired page register element. The selection data and an access enable signal activate a memory access gate to electrically couple a memory access line with a desired memory bit line. Individual bit lines are selectable independently and more than one page register element may be selected at a time. Direct access of a memory bit line allows measurement and characterization operations to be carried out electrically with selected memory cells. This direct electrical access allows instrumentation to make voltage and current measurements necessary for characterization operations. Area that would otherwise be incorporated for an address decoder gate at each bit line selector circuit is saved since no on-chip decoding scheme is necessary. Additional area savings are realized since selection data storage are within a bidirectional storage element already present in a page register element.

Direct memory access interface in integrated circuits

A sense amplifier that is configurable to operate in two modes in order to control a voltage swing on the sense amplifier output. The sense amplifier has two feedback paths including a first feedback path having a transistor with a fast response time in order to allow the circuit to operate as fast as possible, and a second feedback path for providing voltage swing control. In the first operating mode, the &ldquo;turbo&rdquo; mode, both feedback paths are in operation to provide a higher margin of swing control, thus higher sensing speed. In the second operating mode, the &ldquo;non-turbo&rdquo; mode, only the first feedback path is in operation which allows for greater stability and a reduction in power consumption.

Sense amplifier with configurable voltage swing control

A sense amplifier that eliminates or substantially attenuates transients at its output node by isolating the output node from the bitline. The sense amplifier incorporates a sense line transistor between the bitline and the output latching circuit in order to strengthen the voltage value at the output node such that it is not affected by the impedance of the bitline. The sense amplifier also consumes less power and is faster because the bitline does not have to be discharged or precharged by the output driver.

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Santa Clara, CA, United States of America

Nicola Telecco