Robert Boschgmbh

Nicola Mingirulli

Andreas Krauss

Thomas Buck

Fabian Henrici

Daniel Pantel

Wenqing Liu

Robert Bonasewicz

A signal processing device is usable in a communication system and includes a signal path, a signal detector, a signal synthesizer, a transmission unit, and a receive path including an analog-to-digital converter. The signal path transmits a transmission signal that was transmitted by the communication system and that contains a communication signal. The signal detector detects, and generates an activation signal in response to, an interference signal contained in the transmission signal and occurring due to narrowband interferences. The signal synthesizer generates an approximation signal for the interference signal upon the presence of the activation signal. The transmission unit receives the transmission signal transmitted by the signal path and the approximation signal, and outputs a difference signal between the transmission signal and the approximation signal. The analog-to-digital converter converts a signal generated based on the difference signal into a digital signal.

Signal processing device for a communication system usable in particular in a battery system

The invention relates to a galvanic cell () comprising a housing () which is equipped with at least one cell coil or a cell stack and comprising a sensor () for detecting the pressure of the galvanic cell (). The housing () has a recess which is formed from a through-opening between an interior and an exterior of the cell (), and the sensor () is arranged outside of the cell () so as to be secured directly or indirectly to the cell. The sensor (), in particular a micro electromechanical system, is in contact with the interior of the galvanic cell () via the recess. The invention additionally relates to a method for producing such a galvanic cell ().

Galvanic cell and method for producing a galvanic cell

At least one semiconductor component is packaged by covering at least one partial surface of the at least one semiconductor component with at least one chemically or physically dissoluble sacrificial material; surrounding the at least one semiconductor component at least partially with a photoablatable packaging material; exposing the sacrificial material on the at least one partial surface of the at least one semiconductor component at least partially by forming at least one trench through at least the packaging material using a light beam; and exposing the at least one partial surface of the at least one semiconductor component at least partially by at least partially removing the previously exposed sacrificial material using a chemical or physical removal method to which the packaging material has a higher resistance than the sacrificial material.

Growing community of inventors

Stuttgart, Germany

Nicola Mingirulli