Nxp B.v.

Nico Berckmans

Ruurd Anne Visser

Piet Wessels

Naveen Agrawal

Gaurav Singh Bisht

Jayaraj Thillaigovindan

Jie Liao

Khin Hoong Lim

Michael John Ben Bolt

Jerome Guillaume Anna Dubois

Disclosed is an integrated circuit die comprising an active substrate including a plurality of components laterally separated from each other by respective isolation structures, at least some of the isolation structures carrying a further component, wherein the respective portions of the active substrate underneath the isolation structures carrying said further components are electrically insulated from said components. A method of manufacturing such an IC die is also disclosed.

Integrated circuit and IC manufacturing method

In order to provide a circuit arrangement () for use in a data transmission system comprising at least one input stage (IS) being connected downstream of at least one bus system (CB), in particular of at least one C[ontroller]A[rea]N[etwork] bus system, the input stage (IS) comprising at least one resistive ladder (RL) for dividing the input signals; and at least one amplifier stage (AS) connected downstream of the input stage (IS), as well as a corresponding method with improved common mode range and with better H[igh]F[requency] performance, it is proposed that that the voltage range of the amplifier stage (AS) is limitated to a defined maximum voltage, in particular to the supply voltage (VCC).

Circuit arrangement and method of operating such circuit arrangement

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Wijchen, Netherlands

Nico Berckmans