Other

Nanochip, Inc.

Intel Corporation

Kolos International LLC

Nickolai Belov

Vladimir Vaganov

Zhaohui Fan

John Heck

Tsung-Kuan Allen Chou

Olga V Belova

Terry Zhu

Some embodiments provide methods, process, systems and apparatus for use in testing multi-axis Micro Electro Mechanical Systems (MEMS) devices. In some embodiments, methods of testing are provided, comprising: selecting, according to a test specification and a test program, at least a first MEMS device on a substrate comprising a plurality of MEMS formed relative to the substrate and applying one or more electrical probes to the first MEMS device; providing power to the first MEMS device through the one or more electrical probes; measuring output signals of the first MEMS device; applying a force to the first MEMS device using a force actuator; measuring a set of output signals of the first MEMS device based on the applied force; and processing test data and generating output test results according to the test specification and test program.

Method of testing of MEMS devices on a wafer level

A seek-scan probe (SSP) memory involves multiple-wafer bonding needing precision small gaps in between. Solder reflow bonding is typically used to join the wafers due to its reliability and ability to hermetically seal. However, solder reflow bonding may not provide a consistently controllable gap due to flowing solder during the bonding process. Thus, a bond stop technique and process is used to provide accurate cantilever to media gap control.

Seek scan probe (SSP) cantilever to mover wafer bond stop

A system and a method of long-term condition monitoring of structures are based on use of autonomous sensing modules, centers for storing and processing data and software for data analysis. An autonomous sensing module contains a set of sensors for measurements of parameters related to the condition of a monitored structure, a non-volatile memory, a wireless data transfer unit, a controller, a clock circuit, a battery, an energy harvesting device and a power management unit. The autonomous sensing module provides a very long-term (40 years or more) functionality and reliability due to both use of at least near hermetic packages for the controller, the non-volatile memory, the battery, the clock circuit and the power management unit and choosing the duration of periods when the sensing module works in active mode in such a way that the average energy consumed by the autonomous sensing module is fully compensated by the average energy harvested by the energy harvesting device.

Autonomous sensing module, a system and a method of long-term condition monitoring of structures

Methods of fabricating 3-dimensional force input control devices are disclosed. These roughly comprise: providing a first substrate, fabricating stress-sensitive IC components and signal processing IC on a side one of the first substrate, fabricating one or more closed trenches on a side two of the first substrate within each die area, creating elastic element, frame area and rigid island, providing a second substrate, patterning a side two of the second substrate to define areas for deep etching, creating a layer of bonding material in local areas on at least one of the surfaces of the side one of the second substrate and the side two of the first substrate, aligning and bonding the side two of the first substrate with the side one of the second substrate, etching the second substrate from the side two through to the first substrate, dicing the two bonded substrates into multiple separate dice.

Force input control device and method of fabrication

In one embodiment a micro-electro mechanical system is disclosed. A MEMS structure can include a frame, a movable structure and a set of structural beams to suspend the movable structure from the frame. The system can also include a set of conductor routing beams. The conductor routing beams can provide a conductive path from the frame to the movable structure. The set of structural beams can have a spring rate that is more than ten times the spring rate of the set of conductor routing beams. Accordingly, multiple routing beams can be utilized to support multiple conductors without significantly affecting the mechanical movement or dynamic properties of the movable structure.

Arrangements for and fabrication of mechanical suspension of a movable structure

A force input control device suitable for high-volume applications such as cell phones, portable gaming devices and other handheld electronic devices along with other applications like medical equipment, robotics, security systems and wireless sensor networks is disclosed. The device can be one-axis or two-axis or three-axis sensitive broadening the range of applications. The device comprises a force sensor die formed within semiconductor substrate and containing a force sensor providing electrical output signal in response to applied external force, and electrical connection elements for mounting and/or wire bonding. Signal conditioning and processing integrated circuit can be integrated within some devices. A package enclosing at least a portion of the force sensor die and comprising a force-transferring element cooperated with the sensor die for transferring an external force to the force sensor die.

Semiconductor input control device

Method of fabricating 3-dimensional force input control device are disclosed. These roughly follow a process of providing a first substrate having side one and side two, fabricating stress-sensitive IC components and signal processing IC on the side one of the first substrate, fabricating closed trenches on the side two of the first substrate within each die area, said closed trenches create elastic element, frame area and at least one rigid island separated from the frame areas, providing a second substrate having side one and side two, patterning side two of the second substrate to define areas for deep etching, creating a layer of bonding material in the local areas on at least one of the surfaces of the side one of the second substrate and the side two of the first substrate, aligning and bonding the side two of the first substrate with the side one of the second substrate, etching the second substrate from the side two through to the first substrate, dicing two bonded substrates onto multiple separate dice, resulting in processed, aligned, bonded and diced batch fabricated low cost 3D force input control devices.

Methods of wafer-to-wafer bonding are disclosed. These methods use a force-transposing substrate providing redistribution of the applied force to the local bonding areas across the wafer. Certain versions of the Present Invention also provide a compliant force-distributing member along with applying bonding material to bonding areas in select locations. A predetermined sequence of external force loading and temperature steps ensure creating bonds between the wafers in the bonding areas. The disclosed methods improve wafer bonding, by increasing its uniformity and strength across the wafer, increasing both reproducibility and yield process and decreasing cost of semiconductor and MEMS devices.

Method of wafer-to-wafer bonding

A force input control device suitable for high-volume applications such as cell phones, portable gaming devices and other handheld electronic devices is disclosed. The device comprises a force sensor die formed within semiconductor substrate and containing a force sensor providing electrical output signal in response to applied external force, connection elements for either flip chip mounting or wire bonding. Signal conditioning and processing integrated circuit is integrated within the device. A package enclosing at least a portion of the force sensor die and comprising a force-transferring element coupled to the sensor die for transferring an external force to the force sensor die. A button, which has multiple ergonomical designs, is mechanically coupled to the force-transferring element of the package for providing an interface with the external force.

Systems in accordance with the present invention can include a tip contactable with a media, the media including a substrate and a plurality of cells disposed over the substrate, one or more of the cells being electrically isolated from the other of the cells by a material having insulating properties. One or more of the plurality of cells can include a phase change material. The media is either grounded or electrically connected with a voltage source such that when the tip is placed in contact with the media and a voltage is applied to the tip, a current is drawn through the cell over which the tip is arranged. The current is drawn through the isolated cell at least a portion of the phase change material within the cell beneath the tip is heated to a sufficient temperature such that the material become amorphous in structure. The current is then removed from the phase change material, which is quickly cooled to form an amorphous domain having a resistance representing a '1' (or a '0'). In another embodiment the one or more of the plurality of cells can include a polarity dependent material. In an embodiment, the one or more cells can have a sidewall structure that tapers along the depth of the cell so that the cell has a wider cross-section near where a tip contacts the media and a narrower cross-section near where the cell contacts one of the substrate and an underlayer.

Patterned media for a high density data storage device

Systems and methods in accordance with the present invention can include a tip contactable with a media. In an embodiment, the tip comprises a substantially hollow structure formed of a metal. The tip can be formed by depositing a first metal layer over silicon thereby defining a cantilever structure, depositing a second metal layer at least partially over the first metal layer, and at least partially over a cone structure of the silicon to define the tip structure. The silicon can then be removed from beneath the cantilever and from within the deposited second metal layer by etching, thereby leaving a low-mass metal tip associated with a metal cantilever. An alternative embodiment, the silicon can be removed from beneath the cantilever by etching, but endpointed such that at least a portion of the cone structure remains beneath the second metal layer. The silicon/metal tip can have good wear characteristics and a slightly higher mass.

Method for forming a reinforced tip for a probe storage device

A system and method for inputting motion measurement data into a computationally based device are provided. In a first version three-axis accelerometer determines components of an inertial force vector with respect to an orthogonal coordinate system. The accelerometer includes a sensor die made of a semiconductor substrate having a frame element, a proof mass element, and an elastic element mechanically coupling the frame and the proof mass. The accelerometer also has three or more stress-sensitive IC components integrated into the elastic element adjacent to the frame element for electrical connectivity without metal conductor traversal of the elastic element.

System and method for a three-axis MEMS accelerometer

3D accelerometer for measuring three components of inertial force (or acceleration) vector with respect to an orthogonal coordinate system, which has high sensitivity due to a big proof mass located within a cavity beneath the surface of the sensor die. The size of the cavity and the size of the proof mass exceed the corresponding overall dimensions of the elastic element. The sensor structure occupies a very small area at the surface of the die increasing the area for ICs need to be integrated on the same chip.

Three-axis integrated MEMS accelerometer

Systems in accordance with the present invention can include a tip contactable with a media, the media including a substrate and a plurality of cells disposed over the substrate, one or more of the cells being electrically isolated from the other of the cells by a material having insulating properties. One or more of the plurality of cells can include a phase change material. The media is either grounded or electrically connected with a voltage source such that when the tip is placed in contact with the media and a voltage is applied to the tip, a current is drawn through the cell over which the tip is arranged. The current is drawn through the isolated cell at least a portion of the phase change material within the cell beneath the tip is heated to a sufficient temperature such that the material become amorphous in structure. The current is then removed from the phase change material, which is quickly cooled to form an amorphous domain having a resistance representing a '1' (or a '0'). In an embodiment, the one or more cells can have a sidewall structure that tapers along the depth of the cell so that the cell has a wider cross-section near where a tip contacts the media and a narrower cross-section near where the cell contacts one of the substrate and an underlayer.

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Los Gatos, CA, United States of America

Nickolai Belov