At&s (China) Co. Ltd.

At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Nick Xin

Mikael Tuominen

Seok Kim Tay

Artan Baftiri

Kim Liu

Henry Guo

Howard Li

A semi-flex component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The stack defines at least one rigid portion and at least one semi-flexible portion. A component is embedded in the at least one rigid portion. A transition region between the at least one semi-flexible portion and the at least one rigid portion of the component carrier has a slanted sidewall.

Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus

A semi-flex component carrier includes a stack having at least one electrically insulating layer structure, at least one electrically conductive layer structure and a stress propagation inhibiting barrier. The stack defines at least one rigid portion and at least one semi-flexible portion. The stress propagation inhibiting barrier includes a plurality of stacked vias filled at least partially with electrically conductive material in an interface region between the at least one rigid portion and the at least one semi-flexible portion and configured to inhibit stress propagation between the at least one rigid portion and the at least one semi-flexible portion during bending.

Semi-flex component carrier with dielectric material having high elongation and low young modulus

An arrangement, a method of manufacturing component carriers and a component carrier are provided. The arrangement includes a central carrier structure having a front side and a back side, a first layer stack having a first surface structure made of another material than the interior of the first layer stack and covered by a first release layer which is attached to the front side, and a second layer stack covered by a second release layer which is attached to the back side.

Arrangement with central carrier and two opposing layer stacks, component carrier and manufacturing method

A component carrier, wherein the component carrier includes: i) a layer stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) a bendable portion which forms at least a part of the layer stack, and iii) a metal layer which forms at least a part of the bendable portion. Hereby, the metal layer extends over at least 75% of the area of the bendable portion.

Component carrier with improved bending performance

A semi-flexible component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure. The layer structures are stacked on top of each other in a stacking direction s. A recess extends from a first main surface of the stack into the stack and extends only partially into one of the at least one electrically insulating layer structure so that an electrically insulating layer structure having a stepped portion is formed. The stepped portion provides a flexible region of the stack with respect to a rigid region of the stack.

Semi-flexible component carrier with stepped layer structure

A semi-flex component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The stack defines at least one rigid portion and at least one semi-flexible portion, and a component embedded in the at least one rigid portion. The at least one electrically insulating layer structure of the stack has a mechanical buffer structure surrounding at least part of the component and has a lower value of the Young modulus than other electrically insulating material of the stack.

A semi-flex component carrier includes a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The stack defines at least one rigid portion and at least one semi-flexible portion. The at least one electrically insulating layer structure forms at least part of the semi-flexible portion and includes a material having an elongation of larger than 3% and a Young modulus of less than 5 GPa.

A component carrier includes a stack comprising at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, a component embedded in the stack, and at least one stress relief opening formed in each of the at least one electrically conductive layer structure arranged in the stack on one side of the component so that a portion of the stack extending from an exterior main surface of the component carrier up to a main surface of the component on said side and including the at least one stress relief opening is free of electrically conductive material.

Stress relief opening for reducing warpage of component carriers

A component carrier with a stack having at least one electrically conductive layer structure and a plurality of electrically insulating layer structures and a component embedded in the stack. The plurality of electrically insulating layer structures include a first dielectric structure and a second dielectric structure differing concerning at least one physical property.

Growing community of inventors

Shanghai, China

Nick Xin