Taiwan Semiconductor Manufacturing Comp. Ltd.

Nick Samra

Stefan Rusu

Alan S Roth

Eric Soenen

Ta-Pen Guo

Paul Ranucci

Rabiul Islam

Ying-Chih Hsu

An interconnect package integrates a photonic die, an electronic die, and a switch ASIC into one package. At least some of the components in the electronic die, such as, for example, the serializer/deserializer circuits, transceivers, clocking circuitry, and/or control circuitry are integrated into the switch ASIC to produce an integrated switch ASIC. The photonic die is attached and electrically connected to the integrated switch ASIC.

Photonics package integration

A flip flop standard cell that includes a data input terminal configured to receive a data signal, clock input terminal configured to receive a clock signal, a data output terminal, and a latch. A bit write circuit is configured to receive a bit write signal. The received data signal is latched and provided at the output terminal in response to the bit write signal and the clock signal. A hold circuit is configured to receive a hold signal, and the received data signal is not latched and provided at the data output terminal in response to the hold signal and the clock signal.

Flip flop standard cell

A semiconductor device includes first, second, and third metallization layers, on top of one another, that are disposed above a substrate, wherein each of the first, second, and third metallization layer includes a respective metallization structure formed in a respective dielectric layer, wherein the second metallization layer is disposed between the first and third metallization layers; and a via tower structure that extends from the first metallization layer to the third metallization layer so as to electrically couple at least part of the respective metallization structures of the first and third metallization layers.

Semiconductor device and method for manufacturing the same

An inductor is formed in an IC device packaging structure. The structure includes an encapsulating material, with a ferromagnetic core in the encapsulation material. A plurality of metal layers are provided in the encapsulation material forming an inductor coil extending around the ferromagnetic core so as to form an inductor.

Packaging layer inductor

A device includes a semiconductor die. The semiconductor die has formed thereon a plurality of multi-phase voltage regulator modules of the same design formed on a common semiconductor substrate.

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Austin, TX, United States of America

Nick Samra