Dow Corning Corporation

Dow Silicones Corporation

Dow Global Technolgoies LLC

Rohm and Haas Company

Dow Corning Ireland Limited

Nick Evan Shephard

Richard Alan Palmer

Robert Harold Krahnke

Timothy B Lueder

Donald Taylor Liles

Nanguo Liu

James Steven Tonge

Khristopher Edward Alvarez

Ryan Christopher Thomas

Dongchan Ahn

Matthew Olsen

Gang Lu

Yi Guo

Hongyu Chen

Ye Wu

Eric Jude Joffre

Zuchen Lin

Don Lee Kleyer

Frederic Gubbels

Loren D Lower

Robert E Kalinowski

Dorab Edul Bhagwagar

Mark David Fisher

Leon Andre Marteaux

Barry M Ketola

Zhengming Tang

Andreas Thomas Wolf

Zachary Wenzlick

John Roberts

Qin Deng

Jiang Peng

Matthew Jeletic

Fumito Nishida

Liam O'Neill

Eric E Joffre

Michael John Watson

Shengqing Xu

Michelle R Cummings

Daniel Trent Berg

Donald Eldred

Patricia Ann Olney

Stuart Leadley

Mark D Fisher

G M Fazley Elahee

Susan M Rhodes

Julia Sunderland

Don Juen

Matt Olsen

Cameron Kadleck

Cheryl Lynn Loch

Pamela Jean Huey

Zhiping Zeng

Xing Wei

Song Gao

Donald V Eldred

Barry Ketola

Susan Rhodes

A one-part room temperature vulcanisable (RTV) silicone composition containing a catalyst comprising (i) a titanate and/or zirconate and (ii) a metal carboxylate salt which cures to a silicone elastomer which may be used as a clear sealant which avoids discolouration and loss of adhesion upon aging.

Sealant composition

A multifunctional organosilicon compound is provided which has the general formula XSi([OSiR]p-0-SiRY)a(R)— ln the formula, X is selected from H and ethylenically un saturated moieties; each Y independently comprises a functional moiety selected from alkoxysilyl moieties, acryloxy moieties, and epoxide moieties; each R is an independently selected hydrocarbyl group; each R1 is an independently selected hydrocarbyl group; subscript a is 1, 2, or 3; and each subscript b is independently 0, 1, or 2. A method of preparing the multifunctional organosilicon compound is also provided. The method comprises reacting (A) an organosilanol compound and (B) a silane compound having at least two hydrolysable groups. A functionalized siloxane compound prepared from the multifunctional organosilicon compound, a method of preparing the functionalized siloxane compound, and an adhesive comprising the functionalized siloxane compound are also provided.

Multifunctional organosilicon compound and related methods, compounds, and compositions

A composition contains an organopolysiloxane having the following average chemical structure: XSiO&#x2014;SiR&#x2014;R'&#x2014;(RSiO)&#x2014;RSi&#x2014;[R&#x2014;(RSiO)&#x2014;RSi&#x2014;R&#x2014;(RSiO)&#x2014;RSi]&#x2014;R&#x2032;&#x2014;RSiO&#x2014;SiX; where X is &#x2014;OSiR&#x2014;R&#x2032;&#x2014;RSiO&#x2014;RSi&#x2014;R&#x2033;-A; R is an alkyl group having from 2 to 6 carbons and aryl groups; R&#x2032;, R&#x2033;, Rand Rare divalent hydrocarbon groups comprising a chain of 2 to 6 methylene units; A is acrylate, methacrylate or trialkoxysilyl; provided that, on average, 60 to 90 mole-percent of the A groups are acrylate and methacrylate; Subscript m has an average value in a range of zero to 10; Subscripts x, y and z each has an average value in a range of zero to 1200; and provided that the average values of m, x, y and z are such that the sum of the average values for x, y and z is in a range of 300-1200 and the molar ratio of methylene units to siloxane units is less than 0.15.

Organopolysiloxane cluster polymer for rapid air cure

A metal aprotic organosilanoxide compound of formula (I): {R&#x2014;Si(R)(R)&#x2014;[O&#x2014;Si(R)(R)]&#x2014;O}-M(&#x2190;L)(X)p (I), wherein Mis a metal atom Al, Ce, Fe, or V, a composition or formulation containing or prepared from it, and methods of making and using them. Each molecule of the metal aprotic organosilanoxide compound is composed of at least one metal atom and at least one aprotic organosilanoxide ligand. The metal aprotic organosilanoxide compound may be used as such or as a constituent in a variety of silicone formulations for adhesives, coatings, elastomers, encapsulants, pottants, and sealants.

Metal aprotic organosilanoxide compound

A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.

Dual cure adhesive composition and methods for its preparation and use

A curable formulation containing a metal aprotic organosilanoxide compound of formula (I): {R&#x2014;Si(R)(R)&#x2014;[O&#x2014;Si(R)(R)]&#x2014;O}M(&#x2190;L)(X)p (I), wherein Mis a metal atom Al, Ce, Fe, Sn, Ti, V, or Zr, a polymerizable organosilicon compound, an organosilicon crosslinker for crosslinking the polymerizable organosilicon compound, and a silicon-based adhesion promoter. Also included is a cured product of curing the curable formulation; a manufactured article containing or prepared from the curable formulation or cured product; and methods of making and using the foregoing. The cured product may be free-standing or disposed on a substrate.

Formulation containing a metal aprotic organosilanoxide compound

Vacuum lamination methods for forming conformally coated articles having a preformed lamination layer conformally coated to or on an object such as an LED array are provided. These vacuum lamination methods utilize a single heating step to heat a middle portion of the preformed lamination layer to a flowable condition prior to the preformed lamination layer being conformally coated over the article, such as the array of light emitting diodes disposed on an inner portion of a first side of a submount wafer.

Vacuum lamination method for forming a conformally coated article and associated conformally coated articles formed therefrom

An electronic article has a perimeter and includes a superstrate, an optoelectronic element disposed on the superstrate, and a silicone encapsulant that is formed from a curable silicone composition and that is disposed on the optoelectronic element sandwiching the optoelectronic element between the superstrate and the silicone encapsulant. The electronic article is formed using a method that includes the step of depositing the curable silicone composition on the optoelectronic element in a pattern defining at least one passage extending from an interior of the electronic article to a perimeter of the electronic article. The method also includes laminating the superstrate, the optoelectronic element, and the curable silicone composition. The curable silicone composition has a complex viscosity of from 10,000 to 50,000,000 cPs at 25&#xb0; C. as measured at 1 radian per second at 1 to 5% strain. During lamination, the curable silicone composition cures to form the silicone encapsulant and air escapes from through the at least one passage.

Method of forming an electronic article

A method of bonding an adherent to a substrate, wherein a primer is applied to the substrate by plasma deposition and the adherent is bonded to the primer treated surface of the substrate, and the primer contains functional groups which chemically bond to functional groups in the adherent.

Bonding an adherent to a substrate via a primer

A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (RSi0), (RSi0), (SiO), (R'), and (RSi0), where each Ris independently an oxygen atom or a divalent hydrocarbon group; each Ris independently divalent hydrocarbon group; each Ris independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3. 

Dual curing polymers and methods for their preparation and use

A process for reducing Ag electromigration in electronic circuitry includes the step of treating the electronic circuitry with an electromigration resistant composition. This process is useful in fabricating electronic devices having electronic circuitry that is close together, such as resistors, capacitors, and displays, e.g., a plasma display panel (PDP) or a liquid crystal display (LCD).

Process for minimizing electromigration in an electronic device

A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIMand TIMapplications in electronic devices.

Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use

A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R2Si0)b, (RSi0)c, (Si0)d, (R)f, and (R3SiO)g, where each Ris independently an oxygen atom or a divalent hydrocarbon group; each Ris independently divalent hydrocarbon group; each Ris independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3. 

Curable compositions contain (i) a free radical polymerizable organosilicon monomer, oligomer or polymer; (ii) an organoborane amine complex; optionally (iii) an amine reactive compound having amine reactive groups; and optionally (iv) a component capable of generating a gas when mixed with a compound bearing active hydrogen and a catalyst. The curable compositions can be used as a rubber, tape, adhesive, foam, pressure sensitive adhesive, protective coating, thin film, thermoplastic monolithic molded part, thermosetting monolithic molded part, sealant, gasket, seal, or o-ring, die attachment adhesive, lid sealant, encapsulant, potting compound, or conformal coating. The compositions can also be used in composite articles of manufacture such as integrally bonded device including electrical and electronic connectors and scuba diving masks, in which substrates are coated or bonded together with the composition and cured.

Siloxanes and silanes cured by organoborane amine complexes

A composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two unsaturated organic groups per molecule, with the proviso that component (I) is free of fluorine atoms; optionally (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, with the proviso that component (II) is free of fluorine atoms; (III) a hydrosilylation catalyst; (IV) a fluoroorganosilicone, with the provisos that (1) component (IV) has at least one functional group reactive with component (I), component (II), or both, (2) when component (II) is not present, then component (IV) has an average of at least two silicon-bonded hydrogen atoms per molecule, and (3) component (IV) is added to the composition in an amount sufficient to provide chemical resistance to a cured product of the composition; and (V) an adhesion promoter.

Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance

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Midland, MI, United States of America

Nick Evan Shephard