Dow Global Technolgoies LLC

Dow Chemical Technologies LLC

Nichole E Nickel

Lih-Long Chu

Yushan Hu

Jeffrey E Bonekamp

John A Naumovitz

Mark G Hofius

James P Maher

Stephen J Skapik, Iii

Eric K Lee

John N Naumovitz

Donald J Gromacki

Robert A Gunther

John Naumovitz

Disclosed are multilayer film structures including a layer (B) that includes a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), including i) an ethylene polymer (EP) including at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer including (a) an ethylene polymer block including at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that includes a polyolefin having at least one melting peak greater than 125 C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably includes (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules including an electronic device such as a PV cell.

Multilayered polyolefin-based films having a layer comprising a crystalline block copolymer composite or a block copolymer composite resin

A multilayer film structure including a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B includes a crystalline block composite resin or a block composite resin and bottom Layer C includes a polyolefin having at least one melting point greater than 125 C.

Multilayered polyolefin-based films having an integrated backsheet and encapsulation performance comprising a layer comprising crystalline block copolymer composite or block copolymer composite

Multilayer structures useful as a backsheet for an electronic device, e.g., a photovoltaic cell, comprise (A) a top layer comprising a polyolefin resin, e.g., ethylene vinyl acetate, and having a top facial surface and a bottom facial surface, (B) a tie layer comprising an adhesive, e.g., an ethylene glycidyl methacrylate, having a top facial surface and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the top layer, and (C) a bottom layer comprising a polyolefin having at least one melting peak greater than 125&#xb0; C., e.g., a polypropylene, and having a top facial layer and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the tie layer.

Co-extruded, multilayered polyolefin-based backsheet for electronic device modules

The invention includes a composition comprising from 40 to 98 weight percent of at least one GPPS, from 0 to 98 weight percent of at least one HIPS, from 0.5 to 10 weight percent at least one styrene block copolymer, from 0.5 to 10 weight percent of at least one polypropylene wherein the combination of GPPS, HIPS, polypropylene and styrene block copolymer make up at least about 90 percent of the composition as well as a film made of the composition, an envelope window patch comprising the film, an envelope comprising the window patch, and a process for making the film.

Window envelopes with scratch resistant window film patches

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Midland, MI, United States of America

Nichole E Nickel