Lawrence Livermore National Security, LLC

University of Illinois

Nicholas X Fang

Christopher M Spadaccini

Robert Matthew Panas

Placid M Ferreira

Maxim Shusteff

Keng Hao Hsu

Brett Kelly

Allison E Browar

Johannes Henriksson

Xiuling Li

George Roy Farquar

Todd Weisgraber

Jun Xu

Winston Chern

Ik Su Chun

Peter Lee Schultz

Kyle E Jacobs

Anil Kumar

Steven Gemberling

Matthew Alonso

Howon Lee

A multi-beam volumetric resin curing system and method for whole-volume additive manufacturing of an object includes a bath containing a photosensitive resin, a light source for producing a light beam, and a spatial light modulator which produces a phase- or intensity-modulated light beam by impressing a phase profile or intensity profile of an image onto a light beam received from the light source. The system and method also include projection optics which then produces multiple sub-image beams from the modulated light beam which are projected to intersect each other in the photosensitive resin to cure select volumetric regions of the resin in a whole-volume three-dimensional pattern representing the object.

Multi-beam resin curing system and method for whole-volume additive manufacturing

A high-resolution P&#x3bc;SL system and method incorporating one or more of the following features with a standard P&#x3bc;SL system using a SLM projected digital image to form components in a stereolithographic bath: a far-field superlens for producing sub-diffraction-limited features, multiple spatial light modulators (SLM) to generate spatially-controlled three-dimensional interference holograms with nanoscale features, and the integration of microfluidic components into the resin bath of a P&#x3bc;SL system to fabricate microstructures of different materials.

High resolution projection micro stereolithography system and method

A new method for forming an array of high aspect ratio semiconductor nanostructures entails positioning a surface of a stamp comprising a solid electrolyte in opposition to a conductive film disposed on a semiconductor substrate. The surface of the stamp includes a pattern of relief features in contact with the conductive film so as to define a film-stamp interface. A flux of metal ions is generated across the film-stamp interface, and a pattern of recessed features complementary to the pattern of relief features is created in the conductive film. The recessed features extend through an entire thickness of the conductive film to expose the underlying semiconductor substrate and define a conductive pattern on the substrate. The stamp is removed, and material immediately below the conductive pattern is selectively removed from the substrate. Features are formed in the semiconductor substrate having a length-to-width aspect ratio of at least about 5:1.

Method of forming an array of high aspect ratio semiconductor nanostructures

Disclosed herein are electrochemical fabrication platforms for making structures, arrays of structures and functional devices having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods, systems and system components use an electrochemical stamping tool such as solid state polymeric electrolytes for generating patterns of relief and/or recessed features exhibiting excellent reproducibility, pattern fidelity and resolution on surfaces of solid state ionic conductors and in metal. Electrochemical stamping tools are capable high throughput patterning of large substrate areas, are compatible with commercially attractive manufacturing pathways to access a range of functional systems and devices including nano- and micro-electromechanical systems, sensors, energy storage devices, metal masks for printing, interconnects, and integrated electronic circuits.

Direct nanoscale patterning of metals using polymer electrolytes

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Belmont, MA, United States of America

Nicholas X Fang