Google Inc.

Nicholas Stevens-Yu

Madhusudan K Iyengar

Norman Paul Jouppi

Christopher Gregory Malone

Teckgyu Kang

Woon-Seong Kwon

Melanie Beauchemin

Emad Samadiani

Padam Jain

Connor Burgess

Yingying Wang

Yuan Hang Li

Yuan Li

A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material ('TIM') having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.

Methods and heat distribution devices for thermal management of chip assemblies

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Palo Alto, CA, United States of America

Nicholas Stevens-Yu