Intel Corporation

Nicholas R Weber

Mark Charles Carbone

Juha Paavola

James W Edwards

Meenakshi Gupta

Nicolas A Kurczewski

Brian R Peil

Particular embodiments described herein provide for an electronic device that can be configured to include one or more heat sources, a heat pipe embedded in a chassis of the electronic device, where the heat pipe is thermally coupled to the one or more heat sources to collect heat from the one or more heat sources, and a thermal cooling device, where the thermal cooling device is thermally coupled to the heat pipe and can dissipate heat collected from the heat pipe using air from outside the chassis. In an example, the heat pipe is an oscillating heat pipe and has a thickness between about two (2) millimeters to about twelve (12) millimeters.

Chassis embedded heat pipe

A system and method for adaptive thermal and performance management in electronic devices are disclosed. A particular embodiment includes: providing a processor with a plurality of selectable performance levels and a sensor in an electronic device; receiving sensor information from the sensor, the sensor information including information for determining if the electronic device is positioned proximately to an active airflow; determining a device context from the sensor information; and dynamically modifying the performance level of the processor by implementing one of a plurality of selectable performance levels of the processor based on the device context.

System and method for adaptive thermal and performance management in electronic devices

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Beaverton, OR, United States of America

Nicholas R Weber