Advanced Micro Devices Corporation

Nicholas Poteracki

Jefferson Blake West

Matthew C Grossman

Christopher M Jaggers

Paul G Hughes

Ali Akbar Merrikh

Steve Capezza

Christopher Janak

David A McAfee

Various computing devices, thermal solutions and enclosures are disclosed. In one aspect, a computing device enclosure is provided that includes a first compartment that has a first upper side and is adapted to house the computing device and a liquid cooling device. The computing device has at least one heat generating component operable to transfer heat to the liquid cooling device. A second compartment has a lower side that includes an air inlet and a second upper side that has an air outlet. The second compartment is adapted to house a head exchanger to remove hear transferred to the liquid cooling device. A hub connects the first second compartment to the first compartment in spaced apart relation so as to leave a gap between the first upper side and the lower side.

Multi-compartment computing device with shared cooling device

Growing community of inventors

Austin, TX, United States of America

Nicholas Poteracki