Qualcomm Incorporated

Nicholas Ka Ming Yu

Seung Hyuk Kang

Xiaochun Zhu

Matthew Michael Nowak

Jeffrey Alexander Levin

Robert P Gilmore

Wenqing Wu

Kendrick Hoy Leong Yuen

Jianwen Xu

Lizabeth Ann Keser

Steve Joseph Bezuk

William Michael Stone

A wafer level package device may include a molding compound that encapsulates a substrate, a back end of line and front end of line layer on the substrate and a passivation layer of a redistribution layer without encapsulating a metal layer on the passivation layer. The molding compound may eliminate sidewall chipping and cracking as well as reduce the need for back side lamination.

Wafer level package without sidewall cracking

A probabilistic programming current is injected into a cluster of bi-stable probabilistic switching elements, the probabilistic programming current having parameters set to result in a less than unity probability of any given bi-stable switching element switching, and a resistance of the cluster of bi-stable switching elements is detected. The probabilistic programming current is injected and the resistance of the cluster state detected until a termination condition is met. Optionally the termination condition is detecting the resistance of the cluster of bi-stable switching elements at a value representing a multi-bit data.

Method and apparatus of probabilistic programming multi-level memory in cluster states of bi-stable elements

Growing community of inventors

San Diego, CA, United States of America

Nicholas Ka Ming Yu