Zoox, Inc.

Te Connectivity Services Gmbh

Te Connectivity Corporation

Tyco Electronics UK Ltd

Nicholas John Swatko

Thomas Dean Ratzlaff

Paul Craig Tally

Silas Kogure Wilkinson

Anubhav Thakur

Carter William McEathron

Jaime Andres Ocampo Villegas

Laura Rose Plaxico

Jonathan Mark Eyles

Roy MacNaughton

A thermal management assembly may implement cooling techniques to cool at least a portion of a computer system with one or more cooling systems. The techniques may include using a thermal management assembly in fluid communication with the cooling system(s) to supply fluid from at least one of the cooling systems to at least a portion of the computer system. The techniques may also or instead include using a first thermal coupling to transfer thermal energy between the first cooling system and the computer system and a second thermal coupling to transfer thermal energy between the second cooling system and the computer system. Cooling a computer system using the cooling techniques described herein lowers an operating temperature of the computer system thereby mitigating heat related computer failure.

Redundant computer cooling architecture

Vehicle computer cooling architecture

A thermal management system may cool at least a portion of a computer system with one or more cooling systems. The thermal management system can include one or more modular heatsink assemblies. The modular heatsink assemblies can include scalable heat spreader panels that are thermally coupled to a portion of the one or more cooling systems. The modular heatsink assembly can be positioned above and/or adjacent to a computer component, such as a dual in-line memory module. The scalable heat spreader panels are shaped to fit in between and to the sides of the computing component to draw heat away from the computing component.

Modular heatsink for vehicle computer cooling architecture

Clamping device includes a clamp frame that is configured to move between an open configuration, in which the clamp frame is configured to receive at least one longitudinal element, and a closed configuration, in which the clamp frame wraps around and holds the at least one longitudinal element. The clamp frame includes a coupling end having an inner surface and a coupling base having an outer surface. The inner and outer surfaces have profiles that form a locked engagement to hold the clamp frame in the closed configuration. The clamping device also includes a secondary locking mechanism that secures the coupling end and the coupling base to each other. The secondary locking mechanism is activated after the clamp frame is held in the closed configuration by the locked engagement.

Clamping device configured to hold one or more longitudinal elements

A low profile component tie includes a strap having a top and a bottom. The strap is configured to wrap around a component with the bottom facing the component. The strap has sides between the top and the bottom. The strap has teeth disposed along at least one of the sides. The strap extends between a root end and a distal end. A head is provided at the root end of the strap. The head has a channel configured to receive the strap. The head has at least one pawl provided in the channel. The pawl engages at least one of the teeth along the side of the strap to secure the strap in the head.

Low profile component tie

Growing community of inventors

Mountain View, CA, United States of America

Nicholas John Swatko