Corning Incorporated

Nicholas James Smith

Timothy Michael Gross

Daniel Aloysius Nolan

Adam James Ellison

Shandon Dee Hart

Karl William Koch, Iii

Xiaoju Guo

Natesan Venkataraman

Robert Alan Bellman

Sinue Gomez

Guangli Hu

Theresa Chang

Polly Wanda Chu

Michael Thomas Gallagher

Zhongzhi Tang

Patrick Joseph Cimo

Butchi Reddy Vaddi

Indrajit Dutta

Charles Thomas McLaren

James Ernest Webb

Aize Li

Gautam Narendra Kudva

Chunfeng Zhou

Christopher William Drewnowski

Nicholas Ryan Wheeler

Thomas Michael Zajicek

James Patrick Hamilton

James William Zimmermann

Christine Coulter Wolcott

Joseph Edward McCarthy

Heather Bossard Decker

Vasudha Ravichandran

Ruchirej Yongsunthon

Michael Patrick Donovan

Jenny Kim

Jonathan Michael Mis

Yanfei Li

Yi-Cheng Hsieh

Mardochee Reveil

Toshihiko Ono

Cody Vic Cushman

Timothy Evan Dimond

Karl William Iii Koch

Joseph Patrick Cimo

Ioannis Geogios Roudas

A glass substrate with modified surface regions is disclosed. The glass substrate includes an alkali-containing bulk, a first alkali-depleted region, a second alkali-depleted region, and a first ion-exchanged region. The alkali-containing bulk has a first surface and a second surface with the first and second surfaces on opposite sides. The first alkali-depleted region extends into the alkali-containing bulk from the first surface. The second alkali-depleted region extends into the alkali-containing bulk from the second surface. The first ion-exchanged region extends into the alkali-containing bulk from the first surface. The first alkali-depleted region, the second alkali-depleted region, and the first ion-exchanged region each have a substantially homogenous composition. A method of forming the glass substrate is disclosed. The method includes simultaneously forming the first alkali-depleted region and the first ion-exchanged region in the first surface. The method also includes near-simultaneously forming the second alkali-depleted region in the second surface.

Glass with modified surface regions and methods and apparatuses for forming the same via electro-thermal poling and field-assisted ion exchange

A glass element having a thickness from 25 μm to 125 μm, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress σI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Bendable glass stack assemblies, articles and methods of making the same

An apparatus for continuous electro-thermal poling of glass or glass ceramic material, includes a lower support conveying and contacting electrode structure, an upper contacting electrode structure positioned above the lower support structure, and one or more DC bias voltage sources connected to one or both of the upper contacting structure and the lower support structure. A process for continuous electro-thermal poling of glass or glass ceramic sheets or substrates includes heating the sheet or substrate, feeding the sheet or substrate continuously or continually, while applying a DC voltage bias, and cooling the sheet or substrate to within 0-30° C. of ambient temperature.

High throughput electro-thermal poling

A glass substrate according to one or more embodiments is disclosed. The glass substrate includes an alkali-containing bulk, at least one first alkali-depleted region, and at least one second alkali-depleted region. The alkali-containing bulk has a first surface and a second surfaces with the first and second surfaces opposing one another. The at least one first alkali-depleted region extends into the alkali-containing bulk from the first surface. The at least one second alkali-depleted region extends into the alkali-containing bulk from the second surface. The first alkali-depleted region and the second alkali-depleted region are amorphous and have a substantially homogenous composition. The first alkali-depleted region in some embodiments is a first alkali-depleted surface layer that extends across the alkali-containing bulk. The first alkali-depleted region in some embodiments is plurality of first alkali-depleted regions that are spaced apart from one another.

Glass with modified surface regions on opposing sides and methods and apparatuses for forming the same via electro-thermal poling

Embodiments of a glass substrate including an alkali-containing bulk and an alkali-depleted surface layer, including a substantially homogenous composition with at least 51 mol % AlOare disclosed. In some embodiments, the alkali-depleted surface layer includes about 0.5 atomic % alkali or less. The alkali-depleted surface layer can be substantially free of hydrogen and/or crystallites. Methods for forming a glass substrate with a modified surface layer are also provided.

Tough glass composite and method

A glass glass-ceramic composite comprises a substrate comprising an alkali-containing glass bulk, the bulk comprising AlOand SiOand alkali, and a glass-ceramic surface layer, the surface layer comprising an alkali-depleted glass ceramic comprising AlOand SiOwith at least 5% crystalline phase by volume, wherein the alkali-depleted glass ceramic surface layer comprises a mol % AlOof at least 51%. A method of preparing the composite is also disclosed.

Glass and glass ceramic composite and method

A glass or glass-ceramic carrier substrate, the substrate having undergone at least one complete cycle of a semiconductor fabrication process and having also undergone a reclamation process following the end of the semiconductor fabrication process; the glass or glass-ceramic carrier substrate comprising at least one of the following properties: (i) a coefficient of thermal expansion of less than 13 ppm/&#xb0; C.; (ii) a Young's Modulus of 70 GPa to 150 GPa; (iii) an IR transmission of greater than 80% at a wavelength of 1064 nm; (iv) a UV transmission of greater than 20% at a wavelength of 255 nm to 360 nm; (v) a thickness tolerance within the same range as the thickness tolerance of the carrier substrate before undergoing at least one complete cycle of the semiconductor fabrication process; (vi) a total thickness variation of less than 2.5 &#x3bc;m; (vii) a failure strength of greater than 80 MPa using a 4-point-bending test; (viii) a pre-shape of 50 &#x3bc;m to 300 &#x3bc;m.

Recycled glass and glass-ceramic carrier sustrates

An apparatus for continuous electro-thermal poling of glass or glass ceramic material, includes a lower support conveying and contacting electrode structure, an upper contacting electrode structure positioned above the lower support structure, and one or more DC bias voltage sources connected to one or both of the upper contacting structure and the lower support structure. A process for continuous electro-thermal poling of glass or glass ceramic sheets or substrates includes heating the sheet or substrate, feeding the sheet or substrate continuously or continually, while applying a DC voltage bias, and cooling the sheet or substrate to within 0-30&#xb0; C. of ambient temperature.

A stack assembly is provided that includes a glass layer having a thickness, a first and second primary surface and a compressive stress region extending from the second primary surface to a first depth; and a second layer coupled to the second primary surface. The glass layer is characterized by: an absence of failure when the layer is held at a bend radius from about 3 to 20 mm, a puncture resistance of greater than about 1.5 kgf when the second primary surface is supported by (i) an &#x2dc;25 &#x3bc;m thick PSA and (ii) an &#x2dc;50 &#x3bc;m thick PET layer, and the first primary surface is loaded with a stainless steel pin having a flat bottom with a 200 &#x3bc;m diameter, a pencil hardness of at least 8H, and a neutral axis within the glass layer located between the second primary surface and half of the first thickness.

Bendable glass stack assemblies and methods of making the same

A glass element having a thickness from 25 &#x3bc;m to 125 &#x3bc;m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress GI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Embodiments of a article including include a substrate and a patterned coating are provided. In one or more embodiments, when a strain is applied to the article, the article exhibits a failure strain of 0.5% or greater. Patterned coating may include a particulate coating or may include a discontinuous coating. The patterned coating of some embodiments may cover about 20% to about 75% of the surface area of the substrate. Methods for forming such articles are also provided.

Articles with patterned coatings

An organic-inorganic composite, including: a discontinuous phase having a plurality of adjacent and similarly oriented fibers of an inorganic material; and a continuous organic phase having a thermoplastic polymer, such that the continuous organic phase surrounds the plurality of adjacent and similarly oriented fibers of the inorganic material, and the organic-inorganic composite is a plurality of adjacent and similarly oriented fibers of inorganic material contained within a similarly oriented host fiber of the thermoplastic polymer. Also disclosed are methods of making and using the composite.

Organic-inorganic composite fibers and methods thereof

A glass element having a thickness from 25 &#x3bc;m to 125 &#x3bc;m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress &#x3c3;I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Growing community of inventors

Horseheads, NY, United States of America

Nicholas James Smith