Intel Corporation

Nicholas James Harold McKubre

Kevin Lai Lin

Sansaptak W Dasgupta

Richard F Vreeland

Han Wui Then

Disclosed herein are inductor/core assemblies for integrated circuits (ICs), as well as related structures, methods, and devices. In some embodiments, an IC structure may include an inductor and a magnetic core in an interior of the inductor. The magnetic core may be movable perpendicular to a plane of the inductor.

Inductor/core assemblies for integrated circuits

Disclosed herein are integrated circuit (IC) components with dummy structures, as well as related methods and devices. For example, in some embodiments, an IC component may include a dummy structure in a metallization stack. The dummy structure may include a dummy material having a higher Young's modulus than an interlayer dielectric of the metallization stack.

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Portland, OR, United States of America

Nicholas James Harold McKubre