Teradyne, Inc.

Terdyne, Inc.

Nicholas J Teneketges

Keith J Breinlinger

Ronald A Sartschev

Edward A Ostertag

Yeong Joo Yoon

Fernando Aguirre

Juan Cepeda-Rizo

Mohsen Esmailpour

Tarzen Kwok

In one embodiment, a channel board-to-DIB junction multi-module is provided which includes performance critical channel electronics modules within an enclosure encasing the plurality of performance critical channel electronics modules. A coolant distribution apparatus is provided within the enclosure to provide cooling within the enclosure. A channel board connection apparatus is located at a channel board end of the channel board-to-DIB junction multi-module and a cable-less connection apparatus is located at a DIB end of the channel board-to-DIB junction multi-module.

Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment

Automated test equipment is provided which includes a test head having a tester electronics bricks mounted to a device interface board. In some embodiments, support circuitry is positioned adjacent the tester electronics bricks opposite the DIB. The support circuitry may include power circuitry and/or data bus circuitry, which may be coupled to separate sides, or the same side of the tester electronics brick. A heat transfer apparatus located between the DIB and the support circuitry may be provided for cooling the tester electronics bricks. A tester electronics brick may include multi-chip modules arranged so that the edges generally define interface sides of the tester electronics brick. These sides may include a DIB interface side mounted to the DIB, a data bus interface side, a power interface side, and a heat transfer interface side. Contacts may be located at the edges of the MCMs.

Automated test equipment with DIB mounted three dimensional tester electronics bricks

In one embodiment, a substrate assembly includes a flat substrate having oppositely disposed planar surfaces and a conductor. The conductor is formed on at least one of the planar surfaces and defines a conductor plane. The structure further includes an oversized-in-diameter anti-pad formed through the substrate layer and the conductor layer. The anti-pad further includes a dielectric spacer formed substantially coplanar with the conductor plane.

Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies

In one embodiment, a liquid immersion cooled multichip module is provided which includes a substrate having chips mounted thereon and which is adapted to mount with a printed circuit board. A lid is adapted to secure to the printed circuit board so as to mount with the substrate to form a fluid chamber between the lid and the substrate, and to cause the substrate to mate with the printed circuit board. In one embodiment, a cambered bolster plate is located on a side of the printed circuit board opposite the lid and the lid is fastened to the bolster plate to secure the lid to the printed circuit board. A baffle, which may be removable in some embodiments, is located within the lid and directs coolant flow through the fluid chamber.

Liquid immersion cooled multichip module

In at least one embodiment, the present invention is a heat exchange apparatus which includes at least one heat exchanger, an intake manifold, and at least one multichip module. Where the intake manifold is in fluid communication with each heat exchanger and where the intake manifold is capable of providing the heat exchange medium separately to each heat exchanger. Where the each multichip module is positioned at least adjacent to at least one heat exchanger, such that heat can transfer between each multichip module and at least one heat exchanger.

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Thousand Oaks, CA, United States of America

Nicholas J Teneketges