Adeia Semiconductor Bonding Technologies Inc.

Other

Nicholas J Colella

Belgacem Haba

David Bazeley Tuckerman

Giles Humpston

Teck-Gyu Kang

Philip Damberg

Kenneth Allen Honer

Jae M Park

Ronald Patrick Green

David W Wallis

George G Chadwick

Bruce M McWilliams

Charles Liam Goudge

A transmission structure having high propagation velocity and a low effective dielectric loss. The structure comprises a dielectric, a first reference conductor disposed below the dielectric, a signal conductor disposed above the dielectric, and a second reference conductor disposed over the signal conductor. The second reference conductor has a recess portion facing the signal conductor, the recess portion defining a gap between the second reference conductor and the signal conductor. The gap may be filled with air which has a relative dielectric constant approximately equal to one (1). Because of the physical and dielectric constant characteristics of the gap, the structure concentrates an electric field in the gap resulting in an effective dielectric constant approximately (approaching) one (1) and an effective dielectric loss approximately equal to zero (0). Thus, the structure exhibits a propagation velocity approximately equal to the speed of light.

Low loss RF transmission lines having a reference conductor with a recess portion opposite a signal conductor

Image sensors are provided having a plurality of photodetectors in a detector layer Optionally, an optically transparent substrate is provided for a rear-illuminated sensor architecture. The photodetectors may be arranged in three or more arrays. Typically, each array is contiguous and is associated with light of a different color and/or wavelength. In addition, the arrays may be coplanar, or, in the alternative, located at increasing distances from a light-receiving surface in an at least partially nonoverlapping manner. Also provided are image sensor packages.

Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture

A semiconductor assembly includes plural chips stacked one above the other. One or more of the chips is a magnetic random access memory (MRAM). Use of MRAM alleviates problems caused by heat dissipation in the stack.

Packaged systems with MRAM

A microelectronic element such as a semiconductor chip has springs such as coil springs bonded to contacts so that the springs serve as electrical connections to a circuit panel. The unit can be tested readily and can be surface-mounted to a circuit panel by bonding the distal ends of the springs, remote from the microelectronic element, to the panel. The springs can also serve as antennas so as to provide a miniaturized phased array.

Microelectronic assemblies with springs

An elongated strip of a sheetlike substrate bearing microelectronic elements such as semiconductor chips is advanced in a downstream direction through one or more folding stations where successive portions of the substrate are folded so as to form a strip including a plurality of fold packages, each including confronting top and bottom runs and a fold region with one or more of the runs bearing one or more microelectronic elements. The strip incorporating the plural fold packages can be wound on a reel or otherwise handled, stored and shipped to a subsequent manufacturing operation, where individual fold packages can be severed from the strip.

Manufacture of microelectronic fold packages

A system, apparatus and method provide wireless communications to a geographical area. The system includes at least one atmospheric platform serving as a central relay or node using a star network topology for the geographic area. The atmospheric platform carries a payload that comprises communications equipment. The system further includes a plurality of user equipment units located within the geographic area and at least one ground station or gateway for providing an information pathway between the user equipment units. The gateway has network processing and switching equipment for routing the information between the users. A wireless trunkline carries signals between the gateway and the atmospheric platform. The apparatus and method comprise gateway and payload uplink portions and downlink portions. The downlink portions aggregates and de-aggregates user generated information from the platform to the gateway. The uplink portions de-aggregate and aggregate the information and route the information with the network switching equipment to intended user equipment units, from the gateway to the platform. The gateway may also provide information pathways from the platform to user equipment units outside of the geographic area through existing communications infrastructure. The system, apparatus and method utilize a wide, non-contiguous band of spectrum in point-to-point links to carry the combined signal traffic from a multitude of subscribers on the ground to the communications switches at the gateway and vice versa, via the airborne platform. The use of wireless trunklines enables all types of switching, including circuit, cell, packet, or frame, or any combination thereof, to be performed by standard equipment housed in facilities on the ground rather than by specially designed equipment located on the airborne platform.

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Pleasanton, CA, United States of America

Nicholas J Colella