Rosemount Inc.

Nicholas Edward Meyer

Mark George Romo

Eric Petersen

David Matthew Strei

Charles Ray Willcox

Andrew John Wagener

Jack M Cavanaugh

David Jonathon Hillman

Timothy David Lasonne

David M Strei

A process fluid multivariable measurement system is provided. The multivariable measurement system includes a thermowell configured to couple to a process fluid conduit and extend through a wall of the process fluid conduit. The multivariable measurement system also includes a temperature sensor assembly disposed within the thermowell, the temperature sensor assembly having at least one temperature sensitive element disposed therein. The multivariable measurement system also includes a pressure sensor assembly coupled to the thermowell, the pressure sensor assembly having at least one pressure sensitive element disposed therein. The multivariable measurement system further includes transmitter circuitry, communicatively coupled to the temperature sensor assembly and the pressure sensor assembly, configured to receive a temperature sensor signal from the at least one temperature sensitive element and responsively generate a temperature measurement output based on the temperature sensor signal. The transmitter circuitry is further configured to receive a pressure sensor signal from the at least one pressure sensitive element and responsively generate a pressure measurement output based on the pressure sensor signal.

Thermowell with pressure sensing capabilities

A pressure sensor assembly includes a pressure sensor, a pedestal and an electrically conductive header having a header cavity. The pressure sensor includes, an electrically conductive sensing layer having a sensor diaphragm, an electrically conductive backing layer having a bottom surface that is bonded to the sensing layer, an electrically insulative layer having a bottom surface that is bonded to a top surface of the backing layer, and a sensor element having an electrical parameter that changes based on a deflection of the sensor diaphragm in response to a pressure difference. The pedestal is bonded to the electrically insulative layer and attached to the header within the header cavity.

Pressure sensor assembly

A pressure capsule/header assembly for a process fluid pressure transmitter is provided. An isolator plug has an isolation diaphragm at a first end thereof and a second end spaced from the first end. The isolator plug has a fill fluid passageway fluidically coupling the first end to the second end. A header has a first end configured to carry a pressure sensor and a second end spaced from the first end. The header has at least one electrical interconnect extending from the first end to the second end. A biaxial support ring is disposed about an outer surface of the header. The biaxial support ring and the header define a tapered interference interface therebetween. The header is welded to the isolator plug at a first weld and the biaxial support ring is welded to the isolator plug at a location that is spaced from the second end of the header.

High pressure capsule and header for process fluid pressure transmitter

A pressure sensor includes a base having at least one high-pressure contact portion and a diaphragm positioned over the base and having an external top surface facing away from the base and internal surfaces facing the base. The internal surfaces comprising a raised perimeter surrounding an interior, a raised central boss within the interior, and a raised boss arm contiguous with and extending from the raised perimeter toward the interior. At least one of the raised boss arm and raised central boss are aligned with and contact a high-pressure contact portion of the base during an over-pressure event.

Pressure sensor diaphragm with overpressure protection

A sensor includes a diaphragm having a bonding portion and a main boss separated from the bonding portion by at least one channel, the main boss having a first side face, a second side face and a chamfered corner face connecting the first side face to the second side face. A base of the sensor has a first contact area aligned with the main boss and separated from the main boss, wherein the bonding portion of the diaphragm is bonded to the base. At least one sensing element senses movement of the diaphragm.

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Chaska, MN, United States of America

Nicholas Edward Meyer