Cree Gmbh

Nicholas Desilva

Robert E Higley

Russell George Villard

Mark Youmans

Joshua J Markle

Shawn Patrick Keeney

Dante P Nava

Michael S Leung

Charles Richards

A LED lamp has a base and an at least partially optically transmissive enclosure connected to the base. A heat sink is partially disposed in the enclosure and supports a plurality of LEDs. The heat sink comprising a mounting portion positioned in the enclosure for supporting the LEDs and a heat dissipating portion exposed to the ambient environment where the interior of the enclosure is exposed to the ambient environment. The heat sink have a plurality of separate heat sink structures that are mounted to the lamp independently of one another. Each heat sink structure may have a thickness of approximately 1-5 mm. Each heat sink structure may in some embodiments weigh approximately 3.8 to 7.7 grams and in other embodiments weigh approximately 27 grams.

LED lamp

An LED based lamp has an optically transmissive enclosure connected to a base. The base may include a heat sink. A substrate is positioned in the enclosure and supports a plurality of LEDs where the periphery of the substrate has alternating recessed portions and protruding portions that define a plurality of laterally extending projections. One LED is located on each of the projections to increase the amount of down light generated by the lamp.

LED lamp with omnidirectional light distribution

Multi-configurable, high luminous output light fixture systems, devices, and methods are disclosed. Light fixtures can be configured to produce variable light emission outputs and patterns and can include LED packages wherein at least one can be movable with respect to another of the LED packages. In addition, a power supply can selectively dim or turn off at least one of the LED packages. The light fixtures disclosed herein can be used in both high bay and low bay light fixtures.

Multi-configurable, high luminous output light fixture systems, devices and methods

Light-emitting die (LED) Lamps, heat sinks, and related methods are provided. An LED lamp can include a mounting substrate having a top surface, a bottom surface and side edges. An LED package can be disposed on the top surface of the mounting substrate with the LED package comprising an LED chip. The LED lamp can include a heat sink that can include a heat sink base and a spacer extending upward from the base. The spacer can have a mounting area or pad distal from the heat sink base on which the bottom surface of the mounting substrate is disposed. The spacer can also have a width that is less than a width between the side edges of the mounting substrate. The LED lamp can further include a lens disposed over the LED package and the mounting substrate.

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Four Oaks, NC, United States of America

Nicholas Desilva