Bae Systems, Inc.

Nicholas Chandler

Richard John Harper

Murray Jerel Niman

Gary David Panaghiston

Martin Joseph Agnew

A heat exchanger assembly () comprises: a hot fluid flow channel (); a cold fluid flow channel (); and a heat exchanger () disposed between the channels. The heat exchanger comprises a heat sink () and a thermoelectric device (). In some embodiments the fluid flow channels () may be arranged to provide a cross-flow of the hot and cold fluids.

Laminated heat exchanger including a heat sink and a thermoelectric device

There is disclosed herein a layer assembly for a heat exchanger, the layer assembly comprising: at least one heat pump module, the module comprising a thermo-electric cooler (TEC) attached to an island formed from a flow-permissive material; a flow-permissive layer provided with an island-reciprocating recess for substantially corresponding to and accommodating the island; a thermal storage layer comprising a heat transfer matrix material charged with a phase-change material, and provided with a TEC-reciprocating recess for substantially corresponding to and accommodating the TEC, wherein the TEC is attached to the thermal storage layer at a surface of the TEC-reciprocating recess, and the flow-permissive layer and the thermal storage layer are arranged such that the island of flow-permissive material extends into the island-reciprocating recess and a separation exists between the island and the flow-permissive layer.

Layer assembly for heat exchanger

The invention relates to circuit boards and to screening circuits and components on such boards from stray rf interference when they are mounted as arrays or stacks of such circuit boards. The circuit boards () are individually screened by conductive screening layers () as known in the art and the individual screening layers are coupled together by layered interconnects () which connect corresponding screening layers () of the individual circuit boards () together, instead of by vias.

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Maldon, United Kingdom

Nicholas Chandler