National Technology & Engineering Solutions of Sandia, LLC

Nicholas Boynton

Anthony L Lentine

Thomas A Friedmann

Douglas Chandler Trotter

Christopher Todd DeRose

Michael Gehl

Ashok Kodigala

Phillip Harrison Weiner

A hybrid photonic integrated circuit and a method of its manufacture are provided. A SiP functional layer is fabricated on an SOI wafer. A lithium niobate thin film is bonded to the SiP functional layer. The silicon handle layer is removed from the SOI wafer to expose buried oxide, and at least one III-V die is bonded to the exposed buried oxide. In embodiments, at least one waveguiding component is fabricated in the SiP functional layer. In embodiments, the SiP functional layer comprises a top waveguiding layer.

Heterogeneous integration of an electro-optical platform

In an electro-optical modulator, an electro-optical modulation layer is bonded to a cladding layer that overlies a substrate. A modulation zone waveguide is optically coupled to the electro-optical modulation layer and optically coupled to an I/O waveguiding structure embedded in the cladding layer. The I/O waveguiding structure is conformed to guide input light toward the modulation zone waveguide and to guide output light away from the modulation zone waveguide.

Heterogeneously integrated electro-optic modulator

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Albuquerque, NM, United States of America

Nicholas Boynton