Westinghouse Electric Corporation

Northrop Grumman Systems Corporation

Ngon B Nguyen

Franklin B Jones

Charles S Kerfoot

William B Hall

Frank A Lindberg

Frank E Altoz

Richard M Young

Geoffrey B Lansberry

Thomas C Underwood

David L Schantz, Jr

James L Munro

Michael J Ankrom

James H DeOms

Ronnie L Starling

Brian H Smith

Patricia A O'Donnell

Beth A Herman

Eric L Mohler

Joseph J Springer

Gene A Digennaro

Marshall G Jones

William B Winkel

Todd M Zaranski

Brian A DeAbreu

David N Blough

Leroy Laurandeau

Aaron D Valdivia

A packaging for high-power devices such as Insulated Gate Bipolar Transistors includes a direct bonded copper substrate (DBC), such as beryllium oxide (BeO), soldered directly to a heat generating surface of the high-power device. The direct bonded copper substrate (DBC) is, in turn, soldered directly to a liquid cooled heatsink (HS). The packaging improves the thermal management of the heat generated by the high-power device, and is applicable for use in a switching circuit for a 3-phase electric traction motor (M). The assembly also provides for improved wirebonding design in order to use each high-power device to its fullest.

Packaging for electronic power devices and applications using the

An electric vehicle propulsion system having a motor with first and second electrically isolated windings and a system control unit for controlling the motor, wherein the system control unit includes a first power bridge for driving the first windings and a second power bridge for driving the second windings.

Electric vehicle propulsion system employing AC induction motor control

An apparatus for cooling a switching circuit for an electric vehicle, wherein the switching circuit has at least two switching elements connected in series, includes first and second heat sinks, each having two thermally-conductive planar members forming a passage therebetween for channeling cooling fluid, an inlet port in communication with the passage, and an outlet port in communication with the passage, and a substrate for mounting at least one switching element to each of the first and second heat sinks. An ac terminal connects the switching element attached to the first heat sink in series with the switching element attached to the second heat sink, and inlet and outlet manifolds, coupled to the inlet and outlet ports of the first and second heat sinks, circulate cooling fluid through the passages of the first and second heat sinks to cool the switching elements.

Direct cooled switching module for electric vehicle propulsion system

A solid state circuit breaker utilizing fast acting solid state relays which are made up of individual switching circuit modules using silicon metal oxide semiconductor field effect transistors or silicon carbide metal oxide semiconductor field effect transistors. Depending on the power requirements, the individual modules may be arranged to provide heat dissipation while at the same time minimizing the total overall space occupied in the circuit breaker.

Modular solid state relay

A package for power semiconductor components permitting high thermal dissipation and current conductance and including a frame assembly bonded to a substrate on which a power semiconductor chip is mounted. The frame assembly has a wirebonding grid for connecting short, uniform length wirebonds to the surface of the chip. The grid is configured so as to have a portion overlaying and spaced from the chip a distance less than a distance required to connect a wirebond of optimal length to each anode cell of the chip. The package allows a high power semiconductor device to be used as a surface mount device or as a hockey puck.

Semiconductor component package

In one embodiment, the invention is a packaged high power electronic switch in the form of a semiconductor chip having metalized planar cathode and anode terminals and a gate terminal. A refractory annular ring has planar open end faces and side walls having stepped portions. A pair of thermally and electrically conductive planar substrates is bonded to the opposite end faces of the annular ring and is maintained in spaced relation thereby, forming an enclosed space. At least one conductive strap within the space is supported by the stepped portion of the internal side wall and extends to one of the substrates forming an electrical and thermal path. One of said conductive substrates receives one of the planar terminals of the chip in intimate electrical and thermal contact. The strap is electrically coupled to the other of said terminals, for forming a high current path between the substrates via the strap. Additional components, such as a commutating diode and gate protection zener diode, may be employed and provide a self protected switch assembly.

High power self commutating semiconductor switch

A package for a heat generating, high voltage hybrid circuit is disclosed which comprises a package housing having a sidewall structure formed from an electrically insulative, thermally conductive ceramic material that obviates the need for using separate insulator structures between the sidewalls of the package and the electrical feedthroughs which afford electrical access to the circuit contained within the package housing. The feedthroughs include a layer of hardenable material for sealingly mounting a terminal connector through the sidewalls of the package. In one embodiment of the invention, the hardenable material sealingly mounts the terminal connectors of the electrical feedthroughs within circular openings in the sidewall structure. In another embodiment, the terminal connectors of the electrical feedthroughs include flat sections formed from copper directly deposited in recesses located within a ceramic frame disposed between the sidewall structure and the base of the package, and the hardenable material sealingly mounts the lower edge of the wall section over the upper surface of the ceramic frame. Both embodiments provide increased voltage and current carrying capacity in a package structure which is more reliable in operation.

High voltage hybrid package

Growing community of inventors

Jessup, MD, United States of America

Ngon B Nguyen