Thomson-csf

Thales

Ngoc-Tuan Nguyen

Jean-Marc Bureau

Jacques Elziere

Christian LeLong

René Meliga

Nicolas Seres

Daniel Le Bail

A unidirectional acoustic probe including a high-performance interconnection network, and a method of manufacturing such a probe. The unidirectional acoustic probe includes linear piezoelectric transducers on the surface of a dielectric film. The dielectric film includes a connection device to electrically connect the piezoelectric transducers to a control device. The connection device includes primary connection pads, facing the piezoelectric transducers, secondary connection pads, offset with respect to the piezoelectric transducers, so that the transducers can be connected to the control device, and conducting tracks connecting the primary connection pads to the secondary connection pads. The conducting tracks are in a direction perpendicular to the direction defined by a major axis of the piezoelectric transducers.

Unidirectional acoustic probe and method for making same

The invention relates to a surface wave device linked to a base by a conductive material which is anisotropic in a direction perpendicular to the plane of the surface wave device and of the base. This anisotropic conductive material provides for the mechanical efficacy and the encapsulation of the surface wave device. It is deposited locally in the plane of the base, in such a way as to provide for the presence of a cavity in which the surface acoustic waves can propagate.

Surface wave device connected to a base with a conductive adhesive

Multielement sound probe comprising a composite electrically conducting coating and method for making same

A method for the packaging of electronic components, including the mounting of at least one electronic component on its active face side to a base, the base including electrical contacts on an external face and connection pads on a face opposite the external face, and including a first series of via holes connecting the electrical contacts and the connection pads and a second series of holes for use in aspiration. A deformable film is deposited on the face opposite to the active face of the electronic component or components. The deformable film is aspirated through the second series of holes from the face opposite the external face of the base, so as to sheath the electronic component or components. The method may furthermore include, on top of the deformable film, a mineral deposition to provide for the hermetic sealing of the components and a conductive deposition to provide for the shielding. Such an application may find particular application to surface wave filters.

Method for the packaging of electronic components

Growing community of inventors

Mougins, France

Ngoc-Tuan Nguyen