Seagate Technology Incorporated

Ng Kok Cheong

Joel William Hoehn

Yuhong Xiong

Yeoh Hooi Sze

Embodiments of the present disclosure include carriers for a row bar or stack of row bars to be lapped. In some embodiments, the ratio of the coefficient of thermal expansion of at least the bridge of a carrier to the coefficient of thermal expansion of the slider row bar or stack of slider row bars is less than 1.6. In some embodiments, a carrier can include a bridge having a length longer than the row bar or stack of row bars. In some embodiments, one or more bridge bending members can have junction centerlines offset from the corresponding bridge bending members.

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Penang, Malaysia

Ng Kok Cheong