Taiwan Semiconductor Manufacturing Comp. Ltd.

Neng-Chieh Chang

Ming-Da Cheng

Po-Hao Tsai

Wen-Hsiung Lu

Hsu-Lun Liu

A semiconductor package structure includes a conductive pad formed over a substrate. The semiconductor package structure also includes a passivation layer formed over the conductive pad. The semiconductor package structure further includes a first via structure formed through the passivation layer and in contact with the conductive pad. The semiconductor package structure also includes a first encapsulating material surrounding the first via structure. The semiconductor package structure further includes a redistribution layer structure formed over the first via structure. The first via structure has a lateral extending portion embedded in the first encapsulating material near a top surface of the first via structure, and the lateral extending portion has a width increasing in a direction toward the redistribution layer structure.

Semiconductor package structure comprising via structure and redistribution layer structure

A semiconductor package structure includes a conductive pad formed over a substrate. The structure also includes a passivation layer formed over the conductive pad. The structure also includes a first via structure formed through the passivation layer and in contact with the conductive pad. The structure also includes a first encapsulating material surrounding the first via structure. The structure also includes a redistribution layer structure formed over the first via structure. The first via structure has a lateral extending portion embedded in the first encapsulating material near a top surface of the first via structure.

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Tainan, Taiwan

Neng-Chieh Chang