University of Illinois

Toyota Motor Engineering & Manufacturing North America, Inc.

Nenad Miljkovic

Tarek Gebrael

Robert Pilawa-Podgurski

Patrick Birbarah

Thomas Foulkes

Andrew Stillwell

Shailesh N Joshi

Paul Vannest Braun

William P King

Leslie William Bolton

Placid M Ferreira

Gaurav Singhal

Kai-Wei Lan

Patricia B Weisensee

Sanjiv Sinha

Manjunath C Rajagopal

Gowtham Kuntumalla

Akhilesh Sanjay Somani

Arielle R Gamboa

Beomjin Kwon

Soumyadip Sett

Jiaqi Li

Shayan Aflatounian

Tianyu Yang

George Barac

Hanyang Zhao

A cooling system includes a container having a water-based fluid in which are immersed printed circuit boards (PCBs). One or more high-thermal electrical components are disposed on the PCBs. A condenser causes water vapor generated by the one or more high-thermal electrical components to condense and passively return to the water-based fluid. A nano-engineered coating is deposited over the one or more high-thermal electrical components that includes an electrical insulation coating of between two to 25 microns in thickness deposited on the one or more high-thermal electrical components. A metallic nano-layer comprising a porous metallic nano-structure deposited on the electrical insulation coating.

Immersion cooling with water-based fluid using nano-structured coating

An apparatus includes a printed circuit board (PCB), a power component disposed on the PCB, the power component to generate heat, and a multilayered coating disposed over the power component and at least a portion of the PCB to dissipate heat from the power component, the multilayered including: an electrical insulation layer comprising a non-polar compound and disposed on the power component and the at least a portion of the PCB; a chromium layer disposed on the electrical insulation layer; and a copper layer disposed on the chromium layer that is at least 10 microns (μm) thick, the copper layer conformally adhered to a top of the power component and to the PCB.

Multilayered nonpolar, chromium, copper material coatings of power electronics boards for thermal management

A coated substrate that may exhibit anti-scaling properties includes a substrate comprising a metal or alloy, an intermediary layer formed on the substrate, and a non-crosslinked omniphobic coating formed on the intermediary layer. A method of forming an anti-scaling coating on a substrate includes forming an intermediary layer on a substrate comprising a metal or alloy, and forming a non-crosslinked omniphobic coating on the intermediary layer.

Coating for anti-fouling and anti-corrosion on metals

An apparatus for fabricating a hybrid tube includes a rotatable mandrel and a first housing configured to translate alongside the rotatable mandrel while dispensing a first strip to be helically wound about the mandrel. The first housing includes an angle adjustment mechanism to control a dispensation angle of the first strip. The apparatus also includes least one energy or adhesive source for bonding overlapping strip portions on the rotatable mandrel and forming the hybrid tube. The at least one energy or adhesive source is configured for translation alongside the rotatable mandrel.

Method and apparatus for fabricating a hybrid tube

A component with a reflective substrate, a photoresist layer disposed on the reflective substrate, and a light diffusing layer sandwiched between the reflective substrate and the photoresist layer is provided. The light diffusing layer includes an outer metal oxide layer with an outer rough surface configured to diffuse laser light during laser interference lithography of the photoresist layer. The outer metal oxide is also configured to be reduced to a conductive metallic layer during electroplating of the substrate. The outer metal oxide layer includes a plurality of elongated light diffusing elements extending in an outward direction from the substrate such that the outer rough surface diffuses at least 90% of laser light during the laser interference lithography of the photoresist layer.

Electrodeposition compatible anti-reflection coatings for laser interference lithography applications

A method includes coating, via chemical vapor deposition, electronics disposed on a printed circuit board (PCB) with an electrical insulation coating of between one micron to 25 microns. The method further include depositing, on the electrical insulation coating, a metallic nano-layer comprising a porous metallic nano-structure. The method further includes, after the coating and the depositing, immersing the PCB in a water-based fluid to cool the electronics while the electronics are powered on.

A heat and mass transfer component comprises a lubricant-impregnated surface including hydrophobic surface features, which comprise nanostructured surface protrusions having a hydrophobic species attached thereto. The hydrophobic surface features are impregnated with a fluorinated lubricant having a viscosity in a range from about 400 mPa&#xb7;s to about 6000 mPa&#xb7;s. A method of fabricating a lubricant-impregnated surface on a heat and mass transfer component comprises: cleaning a thermally conductive substrate to form a cleaned substrate; exposing the cleaned substrate to a hot water or hot alkaline solution to form a thermally conductive substrate having nanostructured surface protrusions; depositing a hydrophobic species on the nanostructured surface protrusions to form hydrophobic surface features; and coating the hydrophobic surface features with a fluorinated lubricant having a viscosity in a range from 400 mPa&#xb7;s to 6000 mPa&#xb7;s. The heat and mass transfer component may exhibit a substantial increase in heat transfer coefficient during hydrocarbon condensation.

Heat and mass transfer component comprising a lubricant-impregnated surface

An active thermal management system for electronic devices comprises: a heat spreader having an internal channel; a thermally conductive body moveably positioned in the internal channel; and two or more electronic devices in thermal contact with a back surface of the heat spreader and positioned adjacent to the internal channel. A location of the thermally conductive body within the internal channel determines a path for heat flow from the back surface to a front surface of the heat spreader. The location of the thermally conductive body within the internal channel may be selected to minimize a temperature differential (&#x394;T) between the electronic devices.

Active thermal management system for electronic devices and method of achieving device-to-device isothermalization

Growing community of inventors

Urbana, IL, United States of America

Nenad Miljkovic