Lumentum Operations LLC

Jds Uniphase Corporation

Other

Nenad Duricic

Roozbeh Ahmadi

Doug Cross

Sheldon McLaughlin

Shane H Woodside

Pierre D Wall

Steven Harold Moffat

Martin Matthews

Simon Moore-Crispin

Abdul Jaleel K Moidu

Dan Grobnic

Gonzalo De La Puente

Evgueni Ponomarev

David William Charles Markin

Tinko Eftimov

Serguei Roupassov

Dariusz Sieniawski

Andrew Telford

Henry Postolek

Graham Ian Duck

An opto-mechanical package may include a package body having a first opening. The opto-mechanical package may include a coupler in the first opening of the package body. The coupler may have a second opening. The coupler may comprise a flexible element. A coefficient of thermal expansion (CTE) of a material of the coupler may be less than a CTE of a material of the package body. The opto-mechanical package may include a window in the second opening of the coupler. A CTE of a material of the window may be less than the CTE of the material of the coupler. The opto-mechanical package may include a first epoxy joint between a surface of the package body and a surface of the coupler. The opto-mechanical package may include a second epoxy joint between a surface of the coupler and a surface of the window.

Integrated coefficient of thermal expansion (CTE)-flex coupler

An optical device may include an outer box. The optical device may include an inner box within the outer box. The optical device may include a heating element on a surface of the inner box. The heating element may include one or more openings. The optical device may include one or more mounting pads. A mounting pad of the one or more mounting pads may be arranged in an opening of the one or more openings and mechanically couple the inner box to the outer box through the opening.

Heater with mounting pads for mechanical, thermal, and opto-mechanical functionality

An opto-mechanical assembly includes a first thermal control element disposed on a region of a first section of an enclosure; a second thermal control element disposed on a region of a second section of the enclosure; and an optical element that includes a first portion and a second portion. The first thermal control element is configured to heat the first portion of the optical element and to cause the first portion of the optical element to be associated with a first temperature, and the second thermal control element is configured to heat the second portion of the optical element and to cause the second portion of the optical element to be associated with a second temperature. This causes a difference between the first temperature and the second temperature to satisfy a temperature difference threshold. Accordingly, this also causes a temperature gradient along an axis of the optical element to satisfy a temperature gradient threshold.

Dual thermal control element configuration for opto-mechanical assembly

An optical device may include an enclosure including an optical aperture and a plurality of optical components positioned within the enclosure, where the plurality of optical components are to emit and/or receive light through the optical aperture. The optical device may include at least one heating element or cooling element to provide an isothermal environment to the plurality of optical components, where the at least one heating element or cooling element is thermally coupled with the enclosure.

Isothermal enclosure with optical aperture

A method may include identifying, by a device, a set of components of an optical device. The method may include determining, by the device, a set of design criteria based on the set of components of the optical device. The method may include identifying, by the device, an initial heater configuration based on the set of design criteria. The method may include determining, by the device, a set of optimization parameters for determining a target heater configuration based on the set of design criteria. The method may include performing, by the device and based on the set of optimization parameters, an optimization procedure to alter the initial heater configuration to determine the target heater configuration. The method may include providing, by the device, information identifying the target heater configuration based on performing the optimization procedure.

Optimization of heater shape for integrated heater for optical benches

An opto-electronic package having two enclosures in which a first non-hermetic enclosure provides the structural rigidity required to maintain the alignment of the optical components for a predetermined environmental range, and second flexible enclosure that provides a hermetical seal for the opto-electronic package.

Flexible hermetic package for optical device

An optical switching device including an optical switching engine may be packaged by omitting an optical bench and disposing optical elements directly on a base of a housing of the optical switching device. The optical switching engine may be disposed on a ceramic portion of the base, and thermally matched to the ceramic base. The base may be reinforced by the housing walls and optional internal rigidity ribs. The optical elements may be thermally matched to the base, and the lid may be strain relieved by thinning lid edges. The housing may be mounted to an external chassis using soft grummets.

Optical switching device

A hermetically packaged, MEMS array-based ROADM module is disclosed. The enclosure sidewalls and a top lid are made of Kovar, and the base is made of alumina ceramic AuSn-soldered to the enclosure sidewalls. The MEMS array is attached to the ceramic base. The optics are passively pre-aligned using a removable template and epoxied to an optical bench. The optical bench is actively aligned as a whole and attached to the ceramic base. A plurality of electrical feedthrough contact pins extend from the bottom of the ceramic base for connecting the MEMS to a connector on a printed circuit board. In one embodiment of the invention, the ceramic base extends beyond the footprint of the sidewalls of the enclosure of the module, for mounting additional electronic components, for example MEMS driver circuitry chips, directly to the ceramic base of the enclosure.

Packaging a reconfigurable optical add-drop module

An optical bench in a wavelength selective switch (WSS) is mounted using a combination of fixed mounts and stress-free mounts. The WSS is packaged in an enclosure including a base, a sidewall, and a lid. The optical switching engine is attached directly to the base. The optical bench is attached to the base and the optical components supported thereon are aligned with the array of switching elements of the switching engine. The optical bench is attached to the base with at plurality of mounts, which include at least one movable mount supporting movement of the optical bench in a plane parallel to the optical bench and at least one fixed mount maintaining optical alignment between the dispersive element and the array of switching elements.

Stress free mounting of optical bench for WSS

A dispersion compensator has a linearly chirped fiber Bragg grating mounted at two ends of an elongated, channel-shaped heat distributor. The distributor has two thermo-electric coolers at two ends, a heating strip for uniform heating of the distributor, a temperature sensor mounted on the distributor in the middle of the grating region, and longitudinally variable heating means attached to the distributor and extending along its length for effecting a longitudinally varying heating of the grating region. The provision of the heating strip helps maintain linearity of the thermal gradient of the distributor while the longitudinally variable heaters facilitate relatively fast dithering of the temperature of the grating region.

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Ottawa, Canada

Nenad Duricic