Pa&e, Hermetic Solutions Group, LLC

Pacific Aerospace & Electronics, Inc.

Nelson Settles

Hua Xia

Tucker Havekost

Nathan Foster

Steve Hall

Don Larson

David DeWire

Daniel Brown

Shaun Michael McGuire

A hermetically sealed electronic package may include a thermal panel having a panel interior surface and a panel exterior surface with electronic device(s) in thermal communication with the panel interior surface. An enclosure, isolating environmental communication from internal electronic devices and modules, may be coupled to the thermal panel, and the enclosure may have an enclosure interior surface and an enclosure exterior surface. A plurality of electrical feedthroughs may be coupled to the package enclosure for signal and data transmission, and the conducting pin(s) in every electrical feedthrough may be bonded by a hydrophobic sealing material for harsh environmental electrical signal, data and power transmission. The ratio of sealing length over sealing bead diameter in the electrical feedthrough subassembly may have a preferred value from 2 to 3; and the ratio of the sealing bead diameter over pin diameter in the electrical feedthrough subassembly may have a preferred value from 1.5 to 2.0, where a preferred thermal stress resistance could be designed for making highly hermetic sealed electronic package.

Hermetically sealed electronic packages with electrically powered multi-pin electrical feedthroughs

A method for making a downhole electrical feedthrough package where the feedthrough package may include a metal shell forming a shell conduit. A metal web may be coupled to the metal shell, and the metal web may form a web conduit. A conducting pin may extend through the shell conduit and web conduit. A dielectric seal may electrically isolate the conducting pin from the metal web. The dielectric seal may be formed by a bismuth glass based dielectric sealing material system having at least two of the four components selected from BiO, BO, MO, and optionally REO forming a bismuth glass system. MO may be selected from ZnO, BaO, TiO, and FeO, and their glass making pre-cursors. REO may be selected from CeO, YO, ScO, NdO, PrO, and lanthanum series oxides. One or more isolators may be disposed within the shell conduit proximate to the dielectric seal and surrounding a portion of the conducting pin.

Methods of making moisture-resistant downhole electrical feedthroughs

A downhole electrical feedthrough package and method for making the same. The feedthrough package may include a metal shell forming a shell conduit. A metal web may be coupled to the metal shell, and the metal web may form a web conduit. A conducting pin may extend through the shell conduit and web conduit. A dielectric seal may electrically isolate the conducting pin from the metal web. The dielectric seal may be formed by a bismuth glass based dielectric sealing material system having at least two of the four components selected from BiO, BO, MO, and optionally REO forming a bismuth glass system. MO may be selected from ZnO, BaO, TiO, and FeO, and their glass making pre-cursors. REO may be selected from CeO, YO, ScO, NdO, PrO, and lanthanum series oxides. One or more isolators may be disposed within the shell conduit proximate to the dielectric seal and surrounding a portion of the conducting pin.

Moisture-resistant high strength sealing material sealed downhole electrical feedthrough and methods of making the same

An integrated downhole electrical feedthrough package may include a metal shell having a metal web conduit disposed within the metal shell. A sealing channel may extend through the metal web conduit. One or more conducting pins may be disposed in the sealing channels. A dielectric seal may also be disposed in the metal web conduit, and the dielectric seal may electrically isolate the one or more conducting pins from the metal web conduit and metal shell. One or more isolators may also be disposed within the metal conduit and each isolator may surround a portion of each conducting pin disposed in the metal conduit. Each isolator may have a high coefficient of thermal expansion material, and a nonpolar surface which may be positioned proximate to a dielectric seal.

Integrated downhole electrical feedthrough packages

Methods for manufacturing firearms and firearm components from bonded multi-metallic base materials comprising at least two dissimilar metallic materials having different properties, such as weight, density, wear resistance, durability, hardness, and the like, bonded to one another are provided. The bonded multi-metallic materials may be explosively bonded multi-metallic materials. The methods involve providing a bonded multi-metallic substrate material, cutting the rough shape of a component from the bonded multi-metallic substrate material, and machining the rough component shape to a desired three dimensional configuration of the component.

Methods of manufacturing firearms and firearms components comprising bonded multi-metallic materials

Firearms and firearm components are constructed from bonded multi-metallic base materials comprising at least two dissimilar metallic materials having different properties, such as weight, density, wear resistance, durability, hardness, and the like, bonded to one another. The components are fabricated such that the metallic material having higher impact- and wear-resistance is positioned at areas that experience impact, or that include bearing points, wear points, and interfaces with other components, while a lighter weight metallic material is positioned at component locations that don't have rigorous material property requirements. The bonded multi-metallic materials may be explosively bonded multi-metallic materials.

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East Wenatchee, WA, United States of America

Nelson Settles