Analog Devices,inc.

Nelson Kuan

Timothy Spooner

Michael W Judy

Xin Zhang

Peter Farrell

Chetan Paydenkar

Kevin H L Chau

A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.

Stress mitigation in packaged microchips

A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.

Package having a plurality of mounting orientations

Growing community of inventors

Brookline, MA, United States of America

Nelson Kuan