Apple Inc.

Nelson J Kottke

Connor Raymond Duke

Shawn Xavier Arnold

Paul Aurelio Martinez

Yanchu Xu

Benjamin A Bard

Jeffrey M Thoma

Curtis C Mead

Kieran Poulain

Zhong-Qing Gong

Gemin Li

Sung Woo Yoo

Kevin R Richardson

A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.

Printed circuit board assembly having a damping layer

The described embodiments relate generally to printed circuit boards (PCBs) including a capacitor and more specifically to designs for mechanically isolating the capacitor from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Conductive features can be mechanically and electrically coupled to electrodes located on two ends of the capacitor. The conductive features can be placed in corners where the amplitude of vibrations created by the piezoelectric forces is relatively small. The conductive features can then be soldered to a land pattern on the PCB to form a mechanical and electrical connection while reducing an amount of vibrational energy transferred from the capacitor to the PCB.

Acoustically quiet capacitors

Growing community of inventors

Cupertino, CA, United States of America

Nelson J Kottke