Other

Light To Form, LLC

Nelson Caldani

Eric Bretschneider

Shoubert Makanoeich

Tielei Zhang

A LED device is disclosed. The device has a LED area, a boundary element surrounding the LED area, a plurality of chip scale package LEDs in the LED area, a plurality of flip chip LEDs in the LED area, an encapsulate, a first conductive path, and a second conductive. The encapsulate covers the plurality of chip scale package LEDs and the plurality of flip chip LEDs in the LED area. The encapsulate has phosphor. The first conductive path connects the plurality of chip scale package LEDs. The second conductive path connects the plurality of flip chip LEDs. The plurality of chip scale package LEDs and the plurality of flip chip LEDs in the LED area are arranged in rows. Each row comprises alternating chip scale package LEDs and flip chip LEDs.

Chip on board LED device and method

Disclosed are various embodiments of driver circuits that operate to excite devices for light emissions therefrom regardless of the impedance ratings thereof. The driver circuits are particularly suited to service both low impedance light emitting diode lighting devices and high impedance halogen lamps.

Growing community of inventors

Richboro, PA, United States of America

Nelson Caldani