Alliedsignal Inc.

Neil Viernes

Douglas M Smith

Teresa A Ramos

Hui-Jung Wu

James S Drage

Stephen C Wallace

Kevin H Roderick

Lisa Beth Brungardt

A process for treating silica dielectric film on a substrate, which includes reacting a suitable hydrophilic silica film with an effective amount of a multifunctional surface modification agent. The film is present on a substrate and optionally has a pore structure with hydrophilic pore surfaces, and the reaction is conducted for a period of time sufficient for said surface modification agent to penetrate said pore structure and produce a treated silica film having a dielectric constant of about 3 or less, wherein the surface modification agent is hydrophobic and suitable for silylating or capping silanol moieties on such hydrophilic surfaces. Dielectric films and integrated circuits including such films are also disclosed.

Multifunctional reagents for the surface modification of nanoporous silica films

The present invention relates to low dielectric constant nanoporous silica films and to processes for their manufacture. A substrate, e.g., a wafer suitable for the production of an integrated circuit, having a plurality of raised lines and/or electronic elements present on its surface, is provided with a relatively high porosity, low dielectric constant, silicon-containing polymer film composition.

Simplified process for producing nanoporous silica

Use of multifunctional reagents for the surface modification of nanoporous silica films

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Champaign, IL, United States of America

Neil Viernes