Sensata Technologies, Inc.

Neil Petrarca

Edwin Vonk

Shihong Huo

Andrew Legendre

Eric A Wolf

Cory Bousquet

Keith St Pierre

A device for sensing pressure and temperature in a fluid environment includes a cover defining an interior. A thermistor tube is positioned at least partially within the interior, the thermistor tube extending substantially along a longitudinal axis. A port body is also positioned at least partially within the interior, the port body forming a channel which extends along the longitudinal axis for receiving a fluid from the fluid environment. A diaphragm is affixed within the port body. The diaphragm has a first surface exposed to the fluid within the channel and a second surface sealed from the channel.

Method of assembling a sensing device having a double clinch seal

An apparatus senses a pressure of a fluid from a fluid medium. The apparatus has a port body with a peripheral wall surrounding an interior channel. The interior channel extends between a diaphragm on the port body and an opening for receiving the fluid. A strain gauge is disposed on the port body. The strain gauge has two or more resistors connected between input/output pads and ground pads. The resistors are spaced substantially equidistant from the ground pad to reduce mobile ion migration.

Pressure sensor with improved strain gauge

Integrated pressure and temperature sensor

A circuit assembly includes one or more electrical conductors. Each of the electrical conductors has a first axial end and a second axial end; the first axial end is disposed opposite the second axial end. The assembly further comprises a non-electrically conductive retainer component operable to: i) retain the electrical conductor and ii) contact a lateral side and/or tip of the electrical conductor onto a conductive pad of a circuit board. The retainer component exerts an appropriate force with respect to the one or more electrical conductors such that, a respective lateral side and/or tip of each of the electrical conductors contact a corresponding electrically conductive pad on the circuit board.

Connectivity in an assembly

In an embodiment, a sensor substrate includes a first end, a second end, and a body. The body contains provisions for accommodating one or more sense elements. The first end and the second end contain attachment points for attaching the sensor substrate to a shaft. In addition, the first end and the second end include curved portions. For a particular end, a spacing of the attachment points and/or a depth of the curved portion may define, in part, a flexibility of the end. This flexibility may be used to control a sensitivity of the sense elements.

Sensor substrate

A pressure transducer assembly that includes a pressure-responsive diaphragm to which a sensing element is mounted and an electronic package that includes wire-bonding pads adapted be electrically connected to the sensing element by wire bonding equipment. The diaphragm and wire bonding pads are supported within the transducer so that they lie in proximity to each other and in non-intersecting planes.

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Warwick, RI, United States of America

Neil Petrarca