Growing community of inventors

Sodus Point, NY, United States of America

Neil P Redden

Average Co-Inventor Count = 4.61

ph-index = 4

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 38

Neil P ReddenMichael Edgar Long (7 patents)Neil P ReddenJeremy M Grace (7 patents)Neil P ReddenBruce E Koppe (7 patents)Neil P ReddenDennis R Freeman (6 patents)Neil P ReddenThomas W Palone (3 patents)Neil P ReddenMichael L Boroson (2 patents)Neil P ReddenRandolph Brost (2 patents)Neil P ReddenJinmei Zhang (2 patents)Neil P ReddenDavid R Strip (1 patent)Neil P ReddenJustin H Klug (1 patent)Neil P ReddenRobert F Zwaap (1 patent)Neil P ReddenNeil P Redden (9 patents)Michael Edgar LongMichael Edgar Long (87 patents)Jeremy M GraceJeremy M Grace (46 patents)Bruce E KoppeBruce E Koppe (22 patents)Dennis R FreemanDennis R Freeman (20 patents)Thomas W PaloneThomas W Palone (52 patents)Michael L BorosonMichael L Boroson (60 patents)Randolph BrostRandolph Brost (23 patents)Jinmei ZhangJinmei Zhang (3 patents)David R StripDavid R Strip (13 patents)Justin H KlugJustin H Klug (4 patents)Robert F ZwaapRobert F Zwaap (2 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Eastman-kodak Company (7 from 21,594 patents)

2. Global Oled Technology LLC (2 from 262 patents)


9 patents:

1. 8012537 - Controlling the vaporization of organic material

2. 7704554 - Device and method for vaporizing temperature sensitive materials

3. 7625602 - Controllably feeding powdered or granular material

4. 7465475 - Method for controlling the deposition of vaporized organic material

5. 7364772 - Method for coating an organic layer onto a substrate in a vacuum chamber

6. 7238389 - Vaporizing fluidized organic materials

7. 7232588 - Device and method for vaporizing temperature sensitive materials

8. 7166169 - Vaporization source with baffle

9. 6893939 - Thermal physical vapor deposition source with minimized internal condensation effects

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as of
12/5/2025
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