Jentek Sensors, Incorporated

Massachusetts Institute of Technology

Neil J Goldfine

Andrew P Washabaugh

Darrell E Schlicker

Yanko K Sheiretov

David C Grundy

Vladimir A Zilberstein

Todd M Dunford

Ian C Shay

Scott A Denenberg

Karen E Walrath

Robert J Lyons

Mark D Windoloski

Vladimir B Tsukernik

Volker Weiss

Stuart D Chaplan

Zachary Michael Thomas

David C Clark

Kevin P Dixon

Markus Zahn

Christopher A Craven

Saber Bahranifard

Christopher T Martin

David A Jablonski

Wayne D Ryan

James R Melcher, Deceased

Don Straney

James R Melcher

William M Chepolis

Floyd W Spencer

Homer D Eckhardt

Mark Windoloski

Christopher Root

Kevin G Rhoads

J Timothy Lovett

Shayan Haque

Eric Hill

Alexander V Mamishev

Leon B Kristal

Todd A Dunford

Haruhiko Asada

Brian L Manning

Andrew P Washabaugn

Leandro M Lorilla

James M Fisher

Ian C Shav

Eric L Miller

Vladimir Tsukemik

Brian Manning

A system and method are provided for performing a hole inspection performance study. Specimens for the performance study are made from a reconfigurable set of inspection plates. Each plate includes multiple test holes which are located symmetrically. The plates may be of various thicknesses and materials. Each test hole may or may not have a feature such as a crack or machining notch. Such features may be located at various positions of the hole, such as at an edge, within the bore, and at various circumferential positions. A specimen is formed by stacking two or more plates and securing the stack together with an alignment tool. A variety of specimens may be formed by using different combinations of inspection plates and flipping and rotating the member plates.

System and method for hole inspection and qualification

A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.

Measurement system and method of use

A system and method are disclosed for enhancing pit detection and sizing in a test object. Response signatures are created and stored in a signature library to characterize various sensor responses (liftoff, orientation) and pit properties (e.g., depth, width), possibly with or without additional considerations (e.g., edges, cracks). A sensor is placed on and scanned across a surface of interest on the test object. During scanning the sensor is measured repeatedly at regular intervals. An encoder may be used to record the sensor position for each measurement. The measurement results are then correlated with one or more signatures in the signature library. A threshold is used to determine if the correlation is indicative of the detection of a pit. If so additional processing may be performed to estimate pit properties.

System and method for pit detection and sizing

Disclose is a system and method for real-time measurement and feedback of metrology and metallurgical data during additive manufacturing (AM) part fabrication. This solution promises to provide higher performance, lower cost AM parts. A sensor is placed either in the rake/roller or following the rake/roller so that it has no impact on the process efficiency and can be used to provide real-time feedback and an archived digital map of the entire part volume. The solution provides non-contact sensing of AM layer's electrical conductivity in a high-temperature environment, metallurgical property verification, porosity imaging, local defect detection and sizing, local material temperature monitoring, and grain anisotropy imaging. Part geometry, the AM powder, and the laser/material interface are monitored in real-time. Dual mode sensing using magnetoquasistatic and optical sensors enhance results. Real-time nonlinear control of the AM fabrication process is performed based on the sensor data.

In-process quality assessment for additive manufacturing

A system and method are provided for inspecting challenging material locations such as holes. The system may include a sensor cartridge ('mandrel') for hole inspection that has a helical portion to which a sensor array is attached. The radius of the helical portion can be increased or decreased by applying a torque to the helical portion thereby allowing the sensor to be inserted into a hole or pressed against the wall of the hole. A scanner is described to which mandrels can be quickly connected and changed enabling an inspector to quickly switch between different mandrels (e.g., for different holes sizes and sensor configurations). Also disclosed is an inspection procedure and data processing algorithm for performing an inspection. The data processing algorithm utilizes a signature library for enhancing the detection or sizing of features of interest such as cracks. The algorithm and library can account for material edges, various material types.

System and method for hole inspection

System and method for characterizing material condition. The system includes a sensor, impedance instrument and processing unit to collect measurements and assess material properties. A model of the system may be used to enable accurate measurements of multiple material properties. A cylindrical model for an electromagnetic field sensor is disclosed for modeling substantially cylindrically symmetric material systems. Sensor designs and data processing approaches are provided to focus the sensitivity of the sensor to localize material conditions. Improved calibration methods are shown. Sizing algorithms are provided to estimate the size of defects such as cracks and corrosion. Corrective measures are provided where the actual material configuration differs from the data processing assumptions. Methods are provided for use of the system to characterize material condition, and detailed illustration is given for corrosion, stress, weld, heat treat, and mechanical damage assessment.

Method and apparatus for measurement of material condition

Disclosed are method and apparatus for measuring material properties. Segmented field sensors have multiple sensing elements at different spatial geometries to capture field components having substantially different depths of penetration. These sensors are excited and measured on these different sensing elements to facilitate characterization of unknown material properties. This is illustrated in some embodiments using eddy current sensors to characterize materials that are frequency dispersive and/or do not produce a measurable phase shifts. Only a single scalar quantity may provide independent information from one or more of the sensing elements. Property estimation techniques, such as those using precomputed databases of sensor responses are used to estimate the unknown material properties.

Segmented field eddy current sensing for dispersive property measurement and complex structures

Eddy current sensing is governed by the diffusion equation of magnetoquasistatic fields. As such the eddy current sensor's proximity to the object to be inspected (i.e., 'liftoff') significantly affects the sensor's response signal. Methods and apparatus are disclosed for improving performance for an eddy current sensor, though they may also be used for other sensor types. These solutions are beneficial for both single channel eddy current sensors and arrays, and are particularly beneficial for measuring parts with complex surfaces. In some aspects improved performance is achieved by varying the stiffness of the mechanical support for the sensor. Some mechanical supports may exhibit anisotropic stiffness. After performing a scan with an eddy current array, a multi-channel shape filtering module is applied to improve defect detection. The module reduces the variability of defect response measured due to the unpredictability of the defect location transverse to the scan direction.

Complex part inspection with eddy current sensors

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Newton, MA, United States of America

Neil J Goldfine