Rockwell Automation Technologies Incorporated

Neil Gollhardt

Richard Lukaszewski

Bruce W Weiss

Lawrence D Radosevich

Lixiang Wei

Bruce C Beihoff

Daniel G Kannenberg

Andreas A Meyer

Russel J Kerkman

Brian Patrick Brown

David Dale Brandt

Navid RezA Zargari

Rangarajan M Tallam

Garron Koch Morris

Jeremy Jon Keegan

Scott Duane Day

Kevin Louis Baumann

Lee A Gettelfinger

John Balcerak

William K Siebert

Stephen E Denning

William E Brumsickle

Robert Wright Reese

Jie Shen

David Lee Jensen

Paul Jerome Grosskreuz

Wayne H Wielebski

John R Brubaker

David T Rollay

Kevin Baumann

Fahed Hasan Awad

Scott D Day

John A Balcerak

Richard A Lukaszewski

Motor drive power conversion systems are provided including a rectifier and a switching inverter, wherein the switching devices of the rectifier, the inverter and/or of a DC/DC converter are silicon carbide switches, such as silicon carbide MOSFETs. Driver circuits are provided for providing bipolar gate drive signals to the silicon carbide MOSFETs, including providing negative gate-source voltage for controlling the off state of enhancement mode low side drivers and positive gate-source voltage for controlling the off state of enhancement mode high side drivers.

Motor drive with silicon carbide MOSFET switches

Cooling systems include a first passageway forming member that includes first and second ends and at least one connecting recess that opens into first and second passageways formed by the first passageway forming member. A second passageway forming member includes first and second ends and inlet and outlet ports proximate the first end such that the first end, including an elastomeric seal and the inlet and outlet ports, is sealably insertable in and removable from the at least one connecting recess, where the inlet port opens into the first passageway and the outlet port opens into the second passageway, and where, when the first end is inserted in the at least one connecting recess, the elastomeric seal is sandwiched between and in substantial contact with both the first end and the first passageway forming member.

Modular liquid cooling system

A method and apparatus for predicting junction device temperature of at least a first switching device in a power conversion module that includes the first switching device and at least a second switching device, the method comprising the steps of identifying a cross thermal impedance value indicative of how the temperature of the second switching device effects the first switching device temperature and using the cross thermal impedance value to predict the temperature of the at least a first switching device.

Junction temperature prediction method and apparatus for use in a power conversion module

A method and apparatus for predicting junction device temperature of at least a first switching device in a power conversion module that includes a plurality of switching devices, the method comprising the steps of, during switching activity, identifying at least one operating characteristic of the first switching device and solving an equation that uses the identified operating characteristic to predict the temperature of the first switching device where the equation solved is a function of the location of the first switching device with respect to the other switching devices in the plurality.

A method and kit of components for configuring electronics cooling configurations, the kit comprising a plurality of passageway forming members, each forming member including an extruded member having first and second ends and forming at least one passageway and at least one of an input port and an output port that opens into the passageway, each forming member also including at least one plug insert secured to the second end of the forming member to block the at least one passageway, a plurality of elastomeric seals, a plurality of mechanical fasteners, wherein forming members can be arranged adjacent each other with ports aligned and the fasteners can be used to mechanically fasten the forming members together with seals there between to form various cooling configurations.

A technique is disclosed for cooling resistive elements, such as brake resistors used in motor drives, as well as other resistors. A phase change heat spreader is thermally coupled to the resistive element and a continuous phase change cycle takes place in the heat spreader to extract heat from the resistive element. The element and heat spreader may be packaged as a modular unit or may be integrated into a system.

Phase change cooled electrical resistor

A backplane configuration is described for supporting a range of modular components mechanically and for making electrical connections between the components. The backplane is particularly well-suited to power distribution and control applications, such as in industrial motor drives, and so forth. The backplane includes a number of bays or slots for modular components, as well as a bus topography that allows for switched or common connections between the various components.

On-machine backplane mounted modular power and data distribution system

A system, in one embodiment, includes a power distribution center having an enclosure with an access door configured to move between a closed position and an open position. The power distribution center includes a non-contact sensor disposed inside the enclosure, wherein the non-contact sensor includes a non-contact voltage sensor, or a non-contact temperature sensor, or a combination thereof. The power distribution center also includes an indicator viewable outside of the enclosure while the door is in the closed position, wherein the indicator is coupled to the non-contact sensor.

System and method for monitoring a motor control center

A method and apparatus for predicting junction device temperature of at least a first switching device in a power conversion module that includes the first switching device and at least a second switching device, the method comprising the steps of identifying a cross thermal impedance value indicative of how the temperature of the second switching device effects the first switching device temperature an using the cross thermal impedance value to predict the temperature of the at least a first switching device.

A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Electrical power converter method and system employing multiple output converters

Electrical power converter method and system employing multiple-output converters

Modular power converter having fluid cooled support

An electric vehicle drive includes a support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EM/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Fluid cooled vehicle drive module

Growing community of inventors

Fox Point, WI, United States of America

Neil Gollhardt