Rohm & Haas Electronic Materials LLC

Learonal, Inc.

Shipley Company LLC

Neil D Brown

Michael P Toben

Angelo B Chirafisi

Peter R Levey

George A Federman

Jitendra Singh Goela

Yu Luo

Michael A Pickering

Mark Lefebvre

Jamie L Triba

David J Esterl

Robert A Schetty

Kai Wang

Gregory Lai

Nathaniel E Brese

Donald W Thomson

Stanley J Jasne

Rozalia Beica

Colleen A Doyle

Frank Scaraglino

Daniel C Marcktell

Walter Sommer

Methods are disclosed for replenishing tin and its alloying metals in an aqueous electrolytic plating bath using an acidic solution containing stannous oxide. During electroplating of tin or tin alloys the stannous ions and alloying metal ions are depleted. To maintain continuous and efficient electroplating processes predetermined amounts of the plating bath containing tin and its alloying metals are bailed out. The bail out is then mixed with a predetermined amount of acidic solution containing stannous oxide and any alloying metals. The mixture is then retuned to the plating bath to return the stannous ions and alloying metal ions to their steady state concentrations.

Method for replenishing tin and its alloying metals in electrolyte solutions

An optical article and method of making the same are provided. The optical article has optical multi-aperture operation. The optical article has one or more electrically conductive and selectively passivated patterns.

Article having electrically conductive and selectively passivated patterns

UV curable compositions and methods for depositing one or more metal or metal alloy films on substrates are disclosed. The UV curable compositions contain a catalyst, one or more carrier particles, one or more UV curing agents, and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.

UV curable catalyst compositions

Optical article

Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, a flavone compound and a dihydroxy bis-sulfide. The electrolyte compositions are free of lead and cyanide. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.

Lead-free tin alloy electroplating compositions and methods

A composition and method are disclosed. The composition both conditions and activates a dielectric material for metal deposition. The metal may be deposited on the dielectric by electroless methods. The metallized dielectric may be used in electronic devices.

Metallization of dielectrics

An acid electrolyte and method of using the electrolyte to both deposit tin and tin-alloys on iron containing substrates and at the same time perform as a flux to inhibit the formation of haze and stains on the tin and tin-alloys. The electrolytes and methods are suitable for plating on steel.

Acid electrolytes

An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described.

Electroplating composite substrates

Disclosed are electrolyte compositions for depositing tin or tin-alloys at various current densities. Also disclosed are methods of plating such tin or tin-alloys on substrates, such as the high speed tin plating of steel.

Tin electrolyte

Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, alkoxylated aromatic alcohols, and combinations thereof. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.

Electroplating compositions and methods

Provided for is a solution for use in the electroplating of tin and tin alloys comprising a basis solution comprising an acid, optionally a salt thereof, the acid selected from the group consisting of fluoboric acid, an organic sulfonic acid, a mineral acid, or a combination thereof; divalent tin ions; and an antioxidant comprising a hydroxy benzene sulfonic acid or salt thereof, in an amount effective to prevent the oxidation of divalent tin ions. Also provided for is a method for electroplating comprising electroplating a substrate using an electroplating solution comprising a hydroxy benzene sulfonic acid or salt thereof in an amount effective to decrease the oxidation of tin ions.

Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions

The invention relates to an electrolyte for depositing tin-rich tin-silver alloys upon a substrate. This electrolyte includes a basis solution containing a solution soluble tin and silver compounds; a tin chelating agent of a polyhydroxy compound in an amount sufficient to complex tin ions provided by the tin compound; and a silver chelating agent of a heterocyclic compound in an amount sufficient to complex silver ions provided by the silver compound. Preferably, the tin and silver compounds are present in relative amounts to enable deposits containing about 85 to 99% by weight tin and about 0.5 to 15% by weight silver to be obtained.

Electrolyte and tin-silver electroplating process

A process for depositing tin upon a steel strip by high speed electroplating to produce tinplate, which includes a basis solution of an alkyl sulfonic acid, a solution soluble tin compound and a surfactant, preferably of an alkylene oxide condensation compound of 1) an aliphatic hydrocarbon having seven, preferably six or less, carbon atoms and at least one hydroxy group, or 2) an organic compound having no more than a total of twenty carbon atoms in one or two independent or joined rings optionally substituted with an alkyl moeity of six carbon atoms or less. After electroplating, the tinplate is rinsed and the rinse water only needs to be treated for removal of tin ions prior to discharge by normal procedures.

High speed electroplating of tinplate

An electrolyte, system and process for depositing tin, lead or tin/lead alloys upon a substrate by high speed electroplating, which includes a basis solution of an alkyl or alkylol sulfonic acid; and at least one of a solution soluble tin compound or a solution soluble lead compound; and an alkylene oxide condensation compound of (1) an aliphatic hydrocarbon having seven, preferably six or less, carbon atoms and at least one hydroxy group, or (2) an organic compound having no more than a total of twenty carbon atoms in one or two independent or joined rings optionally substituted with an alkyl moeity of less than six carbon atoms.

Growing community of inventors

Merrick, NY, United States of America

Neil D Brown