Cisco Technology, Inc.

Neeraj Kumar Dubey

Rao Yelamarty

Kalpendu Shastri

Soham Pathak

Prakash B Gothoskar

Steven Luther Moyer

Gnyaneshwar Ramakrishna

Adam Jacob Forrer

David Piede

Weizhuo Li

Kal Shastri

Presented herein is a tray for shipping, handling, and/or processing optomechanical components. The tray has a plurality of pockets arranged in an array, wherein each pocket is configured to hold one optomechanical component, and wherein each pocket includes at least one fiducial hole, at least one vacuum hole, a first cradle element configured to support a clip that attaches to one or more optical fibers of the optomechanical component, and a second cradle element configured to support a head of the optomechanical component. Also presented herein is a clip for an optomechanical component that includes a body having a top face and a bottom face, and a plurality of gripping elements arranged in pairs on the bottom face, each pair of gripping elements configured to support a barrel of an optical connector attached to a corresponding optical fiber of the pair of optical fibers.

Tray and clip structure for optomechanical components

Embodiments herein include an optical system, an optical component, and an associated method of passive alignment in which complementary magnetic patterns are used to provide passive alignment between optical elements. The magnetic coupling between the magnetic patterns operates to align optical elements in at least two dimensions. The magnetic coupling provides a temporary holding force on the optical elements until the optical elements are secured using epoxy or other adhesive.

Alignment of optical components using nanomagnets

Embodiments herein include an optical system that passively aligns a fiber array connector (FAC) to a waveguide in a photonic chip. A substrate of the FAC is machined or etched to include multiple grooves along a common axis or plane to hold optical waveguides, or more specifically, the fibers of the optical cables in the FAC. To align the fibers to the photonic chip, one of the fibers is disposed in an alignment trench which has a width that is substantially the same as the diameter of the fiber. When the fiber registers with the alignment trench, the fiber is aligned with a waveguide disposed at the end of the trench. Because the pitch between the fibers can be precisely controlled, aligning one of the fibers using the alignment trench results in the other fibers becoming passively aligned to respective waveguides in the photonic chip.

Passive fiber optic butt coupling using a semiconductor etched feature

Embodiments herein include an optical system that passively aligns an optical component (e.g., a fiber array connector, lens array, lens body, etc.) with a semiconductor substrate using trenches that mate with optical fiber stubs. In one embodiment, the trenches are etched into the semiconductor substrate which provides support to optical devices (e.g., lasers, lens arrays, photodetectors, etc.) that transmit optical signals to, or receive optical signals from, the optical component. An underside of the optical component is etched to include at least two grooves (e.g., V-grooves) for receiving optical fiber stubs. In one embodiment, the optical fiber stubs are a portion of optical fiber that includes the core and cladding but not the insulative jacket. Once the fiber stubs are attached to the grooves, the fiber stubs are disposed into the trenches in the semiconductor substrate thereby passively aligning the optical component to the optical device on the substrate.

Passive alignment of optical components using optical fiber stubs

Growing community of inventors

Sunnyvale, CA, United States of America

Neeraj Kumar Dubey