Intel Corporation

Neelam Prabhu Gaunkar

Telesphor Kamgaing

Georgios C Dogiamis

Henning Braunisch

Diego Correas-Serrano

Aleksandar Aleksov

Stefano Pellerano

Johanna M Swan

Kaan Oguz

Thomas L Sounart

Chintan S Thakkar

I-Cheng Tung

Thomas W Brown

Cooper S Levy

Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment the package substrate comprises a core and buildup layers on the core. In an embodiment, first level interconnect (FLI) pads are on a topmost buildup layer, and the FLI pads have a pitch. In an embodiment, a plurality of vertically oriented planes are embedded in the core, and the vertically oriented planes are spaced at the pitch.

Package substrate with glass core having vertical power planes for improved power delivery

Embodiments disclosed herein include electronic packages with magnetic features and methods of forming such packages. In an embodiment, a package substrate comprises a core and a conductive via through a thickness of the core. In an embodiment, a shell surrounds a perimeter of the conductive via and the shell is a magnetic material. In an embodiment, a surface of the conductive via is spaced away from the shell.

Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate

Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

Components for millimeter-wave communication

Low leakage thin film capacitors for decoupling, power delivery, integrated circuits, related systems, and methods of fabrication are disclosed. Such thin film capacitors include a titanium dioxide dielectric and one or more noble metal oxide electrodes. Such thin film capacitors are suitable for high voltage applications and provide low current density leakage.

Low leakage thin film capacitors using titanium oxide dielectric with conducting noble metal oxide electrodes

Millimeter-wave dielectric waveguide bundle including first and second adjacent dielectric waveguides having different core and/or cladding materials

Millimeter-wave dielectric waveguide including an opening of varying cross-section enclosed within a first material and the first material surrounded by a second material

Microelectronic support for millimeter-wave communication including a transmission line trace and via pad spaced apart from a respective anti-trace and anti-pad

Embodiments may relate to a baseband module with communication pathways for a first data signal and a second data signal. The baseband module may also include a finite impulse response (FIR) filter in a communication path between the first signal input and the second signal output. Other embodiments may be described or claimed.

Dispersive waveguide crosstalk mitigation

Disclosed herein is a millimeter-wave dielectric waveguide connector that includes a first connector interface, a second connector interface, a dielectric material exposed at the first connector interface and the second connector interface, and a metal structure around the dielectric material, wherein the metal structure includes a flared portion at the first connector interfacea.

Embodiments may relate to a communications module comprising with a dispersion compensation module communicatively coupled between a baseband module and a radio frequency (RF) module. The dispersion compensation module may be configured to process a data signal at an intermediate frequency that is between a baseband frequency and a RF frequency. Other embodiments may be described or claimed.

Growing community of inventors

Chandler, AZ, United States of America

Neelam Prabhu Gaunkar