Growing community of inventors

Chandler, AZ, United States of America

Neelam Prabhu Gaunkar

Average Co-Inventor Count = 5.36

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 0

Neelam Prabhu GaunkarTelesphor Kamgaing (14 patents)Neelam Prabhu GaunkarGeorgios C Dogiamis (14 patents)Neelam Prabhu GaunkarHenning Braunisch (10 patents)Neelam Prabhu GaunkarDiego Correas-Serrano (9 patents)Neelam Prabhu GaunkarAleksandar Aleksov (6 patents)Neelam Prabhu GaunkarVeronica Aleman Strong (5 patents)Neelam Prabhu GaunkarStefano Pellerano (2 patents)Neelam Prabhu GaunkarJohanna M Swan (1 patent)Neelam Prabhu GaunkarKaan Oguz (1 patent)Neelam Prabhu GaunkarThomas L Sounart (1 patent)Neelam Prabhu GaunkarChintan S Thakkar (1 patent)Neelam Prabhu GaunkarI-Cheng Tung (1 patent)Neelam Prabhu GaunkarThomas W Brown (1 patent)Neelam Prabhu GaunkarCooper S Levy (1 patent)Neelam Prabhu GaunkarNeelam Prabhu Gaunkar (15 patents)Telesphor KamgaingTelesphor Kamgaing (188 patents)Georgios C DogiamisGeorgios C Dogiamis (150 patents)Henning BraunischHenning Braunisch (115 patents)Diego Correas-SerranoDiego Correas-Serrano (9 patents)Aleksandar AleksovAleksandar Aleksov (220 patents)Veronica Aleman StrongVeronica Aleman Strong (38 patents)Stefano PelleranoStefano Pellerano (52 patents)Johanna M SwanJohanna M Swan (296 patents)Kaan OguzKaan Oguz (96 patents)Thomas L SounartThomas L Sounart (30 patents)Chintan S ThakkarChintan S Thakkar (12 patents)I-Cheng TungI-Cheng Tung (12 patents)Thomas W BrownThomas W Brown (2 patents)Cooper S LevyCooper S Levy (2 patents)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Intel Corporation (15 from 54,472 patents)


15 patents:

1. 12444619 - Physical vapor deposition seeding for high aspect ratio vias in glass core technology

2. 12424719 - Compact surface transmission line waveguides with vertical ground planes

3. 12424716 - RF filters and multiplexers manufactured in the core of a package substrate using glass core technology

4. 12368091 - Package substrate with glass core having vertical power planes for improved power delivery

5. 12347761 - Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate

6. 12255158 - Components for millimeter-wave communication

7. 12255225 - Low leakage thin film capacitors using titanium oxide dielectric with conducting noble metal oxide electrodes

8. 12166261 - Components for millimeter-wave communication

9. 12126068 - Millimeter-wave dielectric waveguide bundle including first and second adjacent dielectric waveguides having different core and/or cladding materials

10. 12126067 - Millimeter-wave dielectric waveguide including an opening of varying cross-section enclosed within a first material and the first material surrounded by a second material

11. 12107314 - Microelectronic support for millimeter-wave communication including a transmission line trace and via pad spaced apart from a respective anti-trace and anti-pad

12. 12088360 - Dispersive waveguide crosstalk mitigation

13. 12021289 - Components for millimeter-wave communication

14. 11955684 - Components for millimeter-wave communication

15. 11916604 - Dispersion compensation for electromagnetic waveguides

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10/28/2025
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