Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Paul H. Mcclelland

Kenneth E. Trueba

Neal W. Meyer

Neal W Meyer

Kit C Baughman

Peter James Fricke

James E Ellenson

Harold Lee Van Nice

Salim Khasawinah

Chien-Hua Chen

Andrew L Van Brocklin

Peter Mardilovich

Kurt M Ulmer

Zhizhang Chen

Andrew Koll

Donald L Michael

Arun K Agarwal

Eric G Hanson

Alfred I Pan

Dennis M Lazaroff

Jennifer M Korngiebel

Glenn W Weberg

Byron K Davis

Gerald E Heppell

Lee Van Nice

Warren Bruce Jackson

Moses Mekala David

Pavel Kornilovich

Ronald Albert Askeland

David A Champion

Kenneth James Eldredge

Gregory Scott Herman

Paul H McClelland

Kenneth E Trueba

Heon Lee

Rui Yang

Matthew David Giere

Jun Gao

Noah C Lassar

Carl E Picciotto

Ronald A Hellekson

Arjang Fartash

Robert Newton Bicknell

Satya Prakash

David Punsalan

Kenneth Michael Kramer

Ronnie Yenchik

James R White

Thach G Troung

Ken Kramer

Jim Ellenson

David Pursalan

Andy Van Brockin

Paul H Mcclelland

An optical interconnect includes a set of splitters. Each splitter includes a source waveguide, a reflection waveguide, an output waveguide, and a partially reflective mirror element with a reflective coating. The source waveguide and the reflection waveguide are optically coupled to the partially reflective element. A photonic signal from the source waveguide is partially reflected off the reflective coating as a reflected signal into the reflection waveguide. The output waveguide is optically coupled to the opposite surface and configured such that a non-reflected portion of the photonic signal propagates into the output waveguide. The reflective coating includes a reflected surface area interfacing with the photonic signal form the source waveguide, and power of the non-reflected portion is a function of the reflective surface area interfacing with source waveguide.

In-plane optical wave guide with area based splitter

Disclosed is a printhead having at least one ink drop generator region, which includes an ink chamber, an orifice through which ink drops are ejected, and a heating element positioned below the ink chamber. The heating element includes a resistor defined therein and a nano-structured surface that is exposed to the ink fluid supplied to the ink chamber. The nano-structured surface takes the form of an array of nano-pillars. The printhead is fabricated by a method that includes: forming a heating element having an oxidizable metal layer as the uppermost layer; forming an aluminum-containing layer on the oxidizable metal layer; anodizing the aluminum-containing layer to form porous alumina; anodizing the oxidizable metal layer so as to partially fill the pores in the porous alumina with metal oxide material; and removing the porous alumina by selective etching to produce a nano-structured surface.

Printhead and method of fabricating the same

This invention relates to a semiconductor having protruding contacts comprising, a first semiconductor substrate having at least one interconnect located substantially within the first substrate, and a second semiconductor substrate having at least one protruding contact point that substantially contacts at least one interconnect.

3D interconnect with protruding contacts

A fuel cell has a substrate with a film deposited thereon. The film has nanowires dispersed therein. Catalytic activity and conductivity is substantially enhanced throughout the film.

Fuel cell with film having nanowires therein

This disclosure relates to a system and method for bonding an interconnect to a dense circuit device with a mechanically clamping substrate.

Bonding an interconnect to a circuit device and related devices

A method of manufacturing a nanowire filament includes forming and fusing actions. In a forming action, close proximity conductors are formed. In another forming action, a junction oxide is formed between the close proximity conductors. In a fusing action, a nanowire filament is fused between the close proximity conductors, through the junction oxide. A circuit is also provided, having first and second close proximity conductors, and a nanowire filament fused between the close proximity conductors.

Nanowire Filament

Determining a displacement of a substantially rigid item relative to a frame of reference between a first time and a second time is described. At the first time, a first set of pointwise measurements of a physical property of the item taken at a plurality of fixed locations relative to the frame of reference is acquired. At the second time, a second set of pointwise measurements of the physical property taken at the plurality of fixed locations is acquired. A first matrix derived from the first set of pointwise measurements is compared to a second matrix derived from the second set of pointwise measurements to determine the displacement.

Displacement sensing by comparing matrices of pointwise measurements

Apparatus and method for making a multi-layered storage structure includes forming a device layer on a single-crystal wafer, cleaving the device layer from the wafer, repeating the forming and cleaving to provide a plurality of cleaved device layers, and bonding the cleaved device layers together to form the multi-layered storage structure.

Storage structure with cleaved layer

Nanowire filament

Tunnel-junction structures are fabricated by any of a set of related methods that form two or more tunnel junctions simultaneously. The fabrication methods disclosed are compatible with conventional CMOS fabrication practices, including both single damascene and dual damascene processes. The simultaneously formed tunnel junctions may have different areas. In some embodiments, tub-well structures are formed with sloped sidewalls. In some embodiments, an oxide-metal-oxide film stack on the sidewall of a tub-well is etched to form the tunnel junctions. Memory circuits, other integrated circuit structures, substrates carrying microelectronics, and other electronic devices made by the methods are disclosed.

Tunnel-junction structures and methods

The invention includes an electronic memory structure. The electronic memory structure includes a substrate. A substantially planar first conductor is formed adjacent to the substrate. An interconnection layer is formed adjacent to the first conductor. A phase change material element is formed adjacent to the interconnection layer. The interconnection layer includes a conductive interconnect structure extending from the first conductor to the phase change material element. The interconnect structure includes a first surface physically connected to the first conductor. The interconnect structure further includes a second surface attached to the phase change material element. The second surface area of the second surface is substantially smaller than a first surface area of the first surface. A substantially planar second conductor is formed adjacent to the phase change material element.

Phase change material electronic memory structure and method for forming

The present invention provides an improved inkjet printhead assembly adapted to reduce and/or withstand the collapse of ink back into the firing chambers. In one embodiment, the printhead assembly includes one or more firing chambers disposed on a porous substrate. An ink supply is connected to the substrate so that ink is allowed to flow through the pores of the substrate from the ink supply to the firing chamber. Thus, a substantial amount of the energy created by the impact of ink collapsing back into the firing chamber is expended within the pores of the substrate. In another embodiment, one or more firing resistors are formed in each firing chamber, and disposed adjacent the periphery of the firing chamber out of the direct impact path of collapsing ink.

Inkjet printhead assembly

The invention contemplates a flexible film, and a printhead (TAB head assembly) comprising the same; the flexible film having a converted surface with improved resistance. The converted surface comprises a carbon rich layer, preferably, Diamond Like Carbon (DLC) created through simultaneous surface treatment by multiplexed lasers.

Ink-jet printhead

A novel polymeric orifice plate for a printhead. The plate includes a recess in the top surface thereof which terminates at a position between the top and bottom plate surfaces. The recess communicates with a bore which passes through the remainder of the plate and terminates at the bottom surface. The recess has an upper end with a first opening therein, a lower end with a second opening therein, a side wall, and a bottom wall at the lower end The first opening is larger than the second opening. Application of physical force to the plate does not disturb the second opening in the recess which is &ldquo;inset&rdquo;. The recessed bottom wall (and possibly the top surface) of the plate may include at least one layer of coating material thereon for protective, wettability-control, and other purposes. These designs insure proper ink drop trajectory and high-quality image generation.

High efficiency orifice plate structure and printhead using the same

Growing community of inventors

Corvallis, OR, United States of America

Neal W Meyer