Lam Research Corporation

Neal K Newton

Hong Shih

Vincent M Wong

Roger Patrick

Tuochuan Huang

Yan Fang

Cliff LaCroix

Chung Ho Huang

Rish Chhatre

Mukesh Shah

Robert Ahrens

Simon Gosselin

Ronald Ramnarine

Kerwin Hoversten

Marco Mora

Integration of semiconductor tool maintenance operations on mobile devices to allow technicians to more accurately perform semiconductor tool maintenance and to allow more accurate analysis of data to improve maintenance procedures to be more repeatable, consistent, and efficient. Remote control of maintenance operations for the semiconductor tool via a portable electronic device decreases the time required to service semiconductor tools and thus increase throughput.

Mobile connectivity and control of semiconductor manufacturing equipment

An apparatus and method adapted to mount an elastomer band in a mounting groove around a semiconductor substrate support used for supporting a semiconductor substrate in a plasma processing chamber, which includes an installation unit having a top ring, a clamp ring, and a base ring, and upon tightening of the top ring onto the base ring, the elastomer band is clamped between the clamp ring and the base ring, and a clamping surface adapted to release the elastomer band on at least one of a lower surface of the clamp ring and/or an upper surface of the base ring. A latch and release mechanism, which releases the elastomer band into the mounting groove by declamping the elastomer band from between the clamp ring and the base ring.

Installation fixture having a micro-grooved non-stick surface

A method of removing an epoxy band from an electrostatic chuck includes securing the electrostatic chuck in a servicing fixture, applying a thermal source to the epoxy band to breakdown a plurality of adhesive bonds securing the epoxy band to the electrostatic chuck, forming a hole in the epoxy band and pulling the epoxy band from the electrostatic chuck. A system for removing an epoxy band from an electrostatic chuck is also described.

Method of removing damaged epoxy from electrostatic chuck

A method of installing an elastomer band as a protective edge seal around a portion of a semiconductor substrate support used for supporting a semiconductor substrate in a plasma processing chamber, which includes expanding an elastomer band into a circular shape having a diameter greater than a diameter of a mounting groove within the substrate support; clamping the elastomer band in the expanded shape between a base ring and a clamp ring; placing the elastomer band over the substrate support in the expanded shape; and releasing the elastomer band from between the base and clamp rings, which contracts the elastomer band into the mounting groove of the substrate support.

Installation fixture for elastomer bands and methods of using the same

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San Jose, CA, United States of America

Neal K Newton