Lockheed Martin Corporation

Neal A Seegmiller

Stuart C Street

A pulsed induction heating system removes bonded elements from underlying substrates. A coil loop of a tool fits around the base of the element to be removed. The tool heats the element and the substrate in short pulses that are followed by brief, non-heated wait periods. The temperature of the substrate is measured during the wait periods between pulses to avoid overheating. When the substrate reaches a target temperature, the adhesive is sufficiently softened such that the element and adhesive are readily scraped off without damaging the substrate.

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Fort Worth, TX, United States of America

Neal A Seegmiller